Reliability Technology for Integrated Circuit Packaging

Bin Zhou, Yunfei En, Si Chen (Autoren)

Buch | Hardcover

551 Seiten

2026
Springer Verlag, Singapore
978-981-95-3884-3 (ISBN)

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This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.

Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.

Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.

Overview of Integrated Circuit Packaging Technology and Reliability.- Physical Properties and Reliability Characteristics of Integrated Circuit Packaging.- Failure Modes, Mechanisms, and Reliability of Plastic Packaging.- Failure Modes, Failure Mechanism and Reliability of Hermetic Packaging.- Failure Modes, Mechanisms, and Reliability of 3D Packaging.- Thermal Performance and Analysis Techniques of Integrated Circuit Packaging.- Mechanical Characteristics and Tests of Integrated Circuit Packaging.- Failure Analysis Techniques for Integrated Circuit Packaging.- Quality and Reliability Assurance in Integrated Circuit Packaging- Reliability of Integrated Circuit Board-level Assembly.

Erscheinungsdatum	29.11.2025
Zusatzinfo	211 Illustrations, color; 199 Illustrations, black and white
Verlagsort	Singapore
Sprache	englisch
Maße	155 x 235 mm
Themenwelt	Technik ► Bauwesen
Themenwelt	Technik ► Elektrotechnik / Energietechnik
Schlagworte	Failure analysis • failure mechanism • package • physical characteristics • Reliability • Thermal performance
ISBN-10	981-95-3884-X / 981953884X
ISBN-13	978-981-95-3884-3 / 9789819538843
Zustand	Neuware