Mechanical Analysis of Electronic Packaging Systems

Stephen A. McKeown (Autor)

Buch | Softcover

376 Seiten

2019
CRC Press (Verlag)
978-0-367-39981-8 (ISBN)

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"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."

Stephen A. McKeown, Lockheed Martin Control Systems, Johnson City, New York.

Analytical tools; thermal performance analysis; mechanical performance analysis; life analysis; other analysis; analysis of test data; reporting and verification.

Erscheinungsdatum	01.10.2019
Verlagsort	London
Sprache	englisch
Maße	152 x 229 mm
Gewicht	725 g
Themenwelt	Technik ► Elektrotechnik / Energietechnik
	Technik ► Maschinenbau
	Technik ► Umwelttechnik / Biotechnologie
ISBN-10	0-367-39981-4 / 0367399814
ISBN-13	978-0-367-39981-8 / 9780367399818
Zustand	Neuware