Mechanical Analysis of Electronic Packaging Systems

Stephen A. McKeown (Autor)

Buch | Hardcover

374 Seiten

1999
Crc Press Inc (Verlag)
978-0-8247-7033-4 (ISBN)

Artikel merken

"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."

Stephen A. McKeown, Lockheed Martin Control Systems, Johnson City, New York.

Analytical tools; thermal performance analysis; mechanical performance analysis; life analysis; other analysis; analysis of test data; reporting and verification.

Erscheint lt. Verlag	6.4.1999
Verlagsort	Bosa Roca
Sprache	englisch
Maße	152 x 229 mm
Gewicht	850 g
Themenwelt	Technik ► Elektrotechnik / Energietechnik
Themenwelt	Technik ► Maschinenbau
ISBN-10	0-8247-7033-1 / 0824770331
ISBN-13	978-0-8247-7033-4 / 9780824770334
Zustand	Neuware