Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering (eBook)

Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method

Seonho Seok (Autor)

eBook Download: PDF

2018
VIII, 115 Seiten
Springer International Publishing (Verlag)
978-3-319-77872-3 (ISBN)

Infos

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.

Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.

Inhalt

Preface 6
Contents 7
1 Overview of MEMS Packaging Technologies 9
1.1 Introduction 9
1.2 Classification of the Existing Packaging Technologies 10
1.2.1 Hard Cap Packaging 10
1.2.2 Thin-Film Cap Encapsulation 11
1.2.3 Polymer Cap Packaging 13
1.3 Transfer Packaging Concepts 15
1.4 Conclusions 17
References 19
2 Microcap (or Microstructure) Transfer Techniques 21
2.1 Tether-Breaking Away 21
2.2 Solder Dewetting 23
2.3 Laser Ablation 24
2.4 Sacrificial Etch 26
2.5 Anti-adhesion Layers 26
2.6 Conclusions 28
References 29
3 Polymer Cap Transfer Packaging Technologies 30
3.1 BCB Cap Transfer Packaging 30
3.1.1 Si Carrier Substrate Removal 30
3.1.2 Post-it-like Debonding of Si Carrier Substrate 33
3.1.3 BCB Cap MEMS Packaging by Post-it-like Debonding 38
3.2 PerMX Cap Packaging 47
3.2.1 Lamination 49
3.2.2 Transfer Packaging 50
3.3 Thermomechanical Modeling of Polymer Cap Packages 52
3.3.1 Thermal Stress of Thin Film on Substrate 52
3.3.2 Wafer Curvature Measurement 54
3.3.3 PerMX Polymer Cap Modeling 55
3.3.4 BCB Polymer Cap Modeling 57
3.4 RF Characterization of Polymer Cap Packaging 66
3.5 Conclusions 67
References 71
4 Buckled Thin Film Cap Transfer Packaging Technology 73
4.1 Theory of Wrinkling of Elastic Film on Compliant Polymer 74
4.2 Concept of Buckled Thin-Film Package 75
4.3 FEM Simulation of the Buckled Thin-Film Package 76
4.4 Buckled Thin-Film Packaging via Transfer Process 79
4.5 Conclusions 85
References 87
5 FEM Modeling of Debonding of Transfer Packaging 88
5.1 Theoretical Background of FEM Debonding Modeling 88
5.1.1 Exponential CZM 90
5.1.2 Bilinear CZM 91
5.2 Modeling of Polymer Cap Debonding 91
5.2.1 Estimation of Interfacial Toughness 92
5.2.2 FEM Modeling 93
5.3 Modeling of Thin-Film Cap Debonding 97
5.4 Conclusions 101
References 105
6 Other Related Manufacturing Technologies 107
6.1 Flexible Polymer Embedded mm-W Filter with Modularized Interface Adhesion 107
6.2 Polymer Cap Deflection mm-W Tunable Filter 112
6.3 3D Antenna Based on Suspended Polymer Membrane 115
6.4 Conclusions 116
References 118

Produkt-Details

• Erscheint lt. Verlag: 27.4.2018
• Reihe/Serie: Springer Series in Advanced Manufacturing
• Reihe/Serie: Springer Series in Advanced Manufacturing
• Zusatzinfo: VIII, 115 p. 106 illus.
• Verlagsort: Cham
• Sprache: englisch
• Themenwelt: Technik ► Maschinenbau
• Schlagworte: MEMS Packaging • Polymer Packaging cap • surface modification • Transfer packaging • Wafer-Level
• ISBN-10: 3-319-77872-2 / 3319778722
• ISBN-13: 978-3-319-77872-3 / 9783319778723