Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering

Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method

Seonho Seok (Autor)

Buch | Hardcover

VIII, 115 Seiten

2018
Springer International Publishing (Verlag)
978-3-319-77871-6 (ISBN)

Artikel merken

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.

Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.

Overview of MEMS packaging technologies.- Adhesion control techniques for debonding.- FEM modeling of debonding.- Polymer cap transfer packaging technologies.- Thin film cap transfer packaging technology.- Other related manufacturing technologies.

Erscheinungsdatum	28.05.2018
Reihe/Serie	Springer Series in Advanced Manufacturing
Zusatzinfo	VIII, 115 p. 106 illus.
Verlagsort	Cham
Sprache	englisch
Maße	155 x 235 mm
Gewicht	314 g
Themenwelt	Technik ► Maschinenbau
Schlagworte	MEMS Packaging • Polymer Packaging cap • surface modification • Transfer packaging • Wafer-Level
ISBN-10	3-319-77871-4 / 3319778714
ISBN-13	978-3-319-77871-6 / 9783319778716
Zustand	Neuware