PVD for Microelectronics: Sputter Desposition to Semiconductor Manufacturing (eBook)

eBook Download: PDF

1998 | 1. Auflage
419 Seiten
Elsevier Science (Verlag)
9780080542928 (ISBN)

Infos

GENERAL DESCRIPTION OF THE SERIES
Physics of Thin Films is one of the longest running continuing series in thin film science, consisting of 25 volumes since 1963. The series contains quality studies of the properties of various thin films materials and systems.
In order to be able to reflect the development of today's science and to cover all modern aspects of thin films, the series, starting with Volume 20, has moved beyond the basic physics of thin films. It now addresses the most important aspects of both inorganic and organic thin films, in both their theoretical as well as technological aspects. Therefore, in order to reflect the modern technology-oriented problems, the title has been slightly modified from Physics of Thin Films to Thin Films.

GENERAL DESCRIPTION OF THE VOLUME
This volume, part of the Thin Films Series, has been wholly written by two authors instead of showcasing several edited manuscripts.

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Physics of Thin Films is one of the longest running continuing series in thin film science, consisting of 25 volumes since 1963. The series contains quality studies of the properties of various thin films materials and systems.In order to be able to reflect the development of today's science and to cover all modern aspects of thin films, the series, starting with Volume 20, has moved beyond the basic physics of thin films. It now addresses the most important aspects of both inorganic and organic thin films, in both their theoretical as well as technological aspects. Therefore, in order to reflect the modern technology-oriented problems, the title has been slightly modified from Physics of Thin Films to Thin Films.This volume, part of the Thin Films Series, has been wholly written by two authors instead of showcasing several edited manuscripts.

Inhalt

Cover 1
Contents 6
Preface 10
Useful Conversion Factors and Constants 14
Chapter 1. Introduction 16
1.1 The Role of PVD in Microelectronics 16
1.2 PVD and the Interconnect Roadmap 27
1.3 Additional Sources of Information on PVD 32
References 35
Chapter 2. Physics of Sputtering 38
2.1 Sputtering 38
2.2 Energy and Angular Distributions of Sputtered Atoms 48
2.3 Other Energetic Processes During Sputtering 54
2.4 Transport of Sputtered Atoms 56
References 63
Chapter 3. Plasma Systems 66
3.1 Diode Plasmas 68
3.2 Plasma Potential 74
3.3 Floating Potential 74
3.4 Flux to the Sheath 75
3.5 DC and RF Plasmas 76
3.6 RF Plasmas 79
3.7 RF Matchboxes 81
3.8 Magnetic Fields 82
3.9 Reactive Sputter Deposition 91
3.10 Practical Plasma Issues in PVD Tools 96
3.11 Plasma Diagnostics and Optical Emission Magnetrons 98
References 100
Chapter 4. The Planar Magnetron 102
4.1 The DC Magnetron 102
4.2 The Planar Magnetron 103
4.3 The Swept-Filed Magnetron 106
4.4 Source Arcing 110
4.5 Low Pressure Sputtering 113
References 115
Chapter 5. Sputtering Tools 118
5.1 Evolution of PVD Tools for Microelectronics 118
5.2 Generic PVD Cluster Tool 130
5.3 The Technology of PVD Cluster Tools 133
5.4 300 mm PVD 187
5.5 PVD Process Mapping 189
5.6 Cost-of-Ownership (CoO) 191
References 196
Chapter 6. Directional Deposition 200
6.1 Damascene Processing 202
6.2 Long Throw Deposition Techniques 206
6.3 Collimated Sputter Deposition 210
References 227
Chapter 7. Planarized PVD: Use of Elevated Temperature and/or High Pressure 230
7.1 Physics of Hot PVD 231
7.2 Elevated Temperature PVD Al 235
7.3 Elevated Temperature PVD Cu 246
7.4 Application of High Pressure 250
7.5 Conclusions 253
References 254
Chapter 8. Ionized Magnetron Sputter Deposition: I-PVD 256
8.1 Experimental Systems 256
8.2 Plasma Aspects 265
8.3 Deposition and Experimental Results 275
8.4 Lining Trenches and Vias 276
8.5 Trench and Via Filling 283
8.6 Electrical Measurements 293
8.7 Materials Properties 295
References 298
Chapter 9. PVD Materials and Processes 300
9.1 Introduction 300
9.2 Metrology 302
9.3 Al Alloys 307
9.4 Titanium 322
9.5 Titanium Nitride 328
9.6 Titanium-Tungsten (Ti-W) Alloys 338
9.7 Refractory Metal Silicides 342
9.8 Copper 346
9.9 PVD and CVD 355
9.10 Upper Lever Metallization 362
References 364
Chapter 10. Process Modeling for Magnetron Deposition 368
10.1 Cathode Surface Models 369
10.2 Transport Modeling 371
10.3 The Water Surface 374
10.4 Conclusion 386
References 387
Chapter 11. Sputtering Targets 390
11.1 Target Fabrication 391
11.2 Target Cooling 393
11.3 Target Burn-In 398
11.4 Target Composition 399
11.5 Target Purity 402
11.6 Target Utilization 404
11.7 Microstructural Engineering 407
11.8 Particle Generation 411
References 414
Index 416

Produkt-Details

• Erscheint lt. Verlag: 29.10.1998
• Mitarbeit: Herausgeber (Serie): Ronald Powell, Stephen M. Rossnagel, Abraham Ulman
• Sprache: englisch
• Themenwelt: Naturwissenschaften ► Chemie ► Physikalische Chemie
• Themenwelt: Naturwissenschaften ► Physik / Astronomie ► Angewandte Physik
• Themenwelt: Naturwissenschaften ► Physik / Astronomie ► Festkörperphysik
• Themenwelt: Technik ► Elektrotechnik / Energietechnik
• Themenwelt: Technik ► Maschinenbau
• ISBN-13: 9780080542928 / 9780080542928