Introduction to Microelectronics Advanced Packaging Assurance
Springer International Publishing (Verlag)
978-3-031-86101-7 (ISBN)
This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.
Navid Asadizanjani is an associate professor in the department of electrical and computer engineering at university of Florida. His research is mainly focused on physical inspection of electronics from device to system level. He investigates novel techniques for integrated circuits counterfeit detection/prevention, system and chip level reverse engineering, anti-reverse engineering, invasive and semi-invasive physical attacks, integrity analysis, etc. using advanced inspection methods including but not limited to 3D X-ray microscopy, Optical imaging, scanning electron microscopy (SEM), focused ion beams (FIBs), THz imaging, etc. in combination with image processing and machine learning algorithms to make the inspection process intelligent and independent from human. He has received several best paper awards and is the co-founder of IEEE-PAINE conference.
Hamed Dalir is an associate professor in the department of electrical and computer engineering at university of Florida specializes in quantum AI, Semiconductor Laser, and high-speed photonics computing. He was the co-founder and CEO of Optelligence LLC from 2020 to 2023, where he oversaw the development, construction, and validation of a variety of cutting-edge technologies, including artificial intelligence devices, ASICs, D/A converters, blockchains, and secure hashing algorithms. Under his leadership, Optelligence LLC raised over $10 million in funding and produced more than 10 patents. Dr. Dalir has received numerous accolades for his contributions to the field, including the prestigious Yoshida Foundation Award for the Development of Future Leaders for Changing Times and the JSPS Young Scientist Fellowship in 2011 and 2014, respectively. Dr. Dalir s research has been supported by a range of organizations, including AFWERX, AFOSR, NASA, Army, AFRL, NIST, ONR, BAH, Broadcom, and private investors. He has published over sixty scholarly articles in high-impact journals such as Nature Communications, Biosensors and Bioelectronics, Optica, Laser Photonics Review, and Applied Physics Review. In addition, Dr. Dalir has delivered over a hundred keynote addresses, invited talks, and topic lectures at universities and international conferences.
Himanandhan Reddy Kottur is senior PhD student with the Electrical and Computer Engineering Department at the University of Florida, Gainesville, FL, USA. His research is focused on developing counterfeit detection and Hardware Security aspect in Semiconductor Advanced packaging. Himanandhan has an MS in Electrical Engineering from the University of Florida.
Introduction to IC Packaging Development and Assembly Processes.- Bonding Techniques Interconnects.- CVD in Semiconductor Packaging.- Etching in Semiconductor Manufacturing: Techniques, Applications, and Performance Metrics in Advanced IC Packaging.- Physical Vapor Deposition in Advanced Semiconductor Packaging.
| Erscheinungsdatum | 24.04.2025 |
|---|---|
| Reihe/Serie | Synthesis Lectures on Engineering, Science, and Technology |
| Zusatzinfo | XIX, 183 p. 45 illus., 43 illus. in color. |
| Verlagsort | Cham |
| Sprache | englisch |
| Maße | 168 x 240 mm |
| Themenwelt | Informatik ► Weitere Themen ► Hardware |
| Technik ► Elektrotechnik / Energietechnik | |
| Schlagworte | Advanced microelectronics packaging Ecosystem • Advanced packaging manufacturing • Emerging trends in advanced packaging • Semiconductor assurance • Testing and reliability |
| ISBN-10 | 3-031-86101-9 / 3031861019 |
| ISBN-13 | 978-3-031-86101-7 / 9783031861017 |
| Zustand | Neuware |
| Informationen gemäß Produktsicherheitsverordnung (GPSR) | |
| Haben Sie eine Frage zum Produkt? |
aus dem Bereich
