Materials for Advanced Packaging

Daniel Lu, C.P. Wong (Herausgeber)

Buch | Hardcover

724 Seiten

2008 | 2009 ed.
Springer-Verlag New York Inc.
978-0-387-78218-8 (ISBN)

Infos

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Inhalt

3D Integration Technologies – An Overview.- Advanced Bonding/Joining Techniques.- Advanced Chip-to-Substrate Connections.- Advanced Wire Bonding Technology: Materials, Methods, and Testing.- Lead-Free Soldering.- Thin Die Production.- Advanced Substrates: A Materials and Processing Perspective.- Advanced Print Circuit Board Materials.- Flip-Chip Underfill: Materials, Process and Reliability.- Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips.- Electrically Conductive Adhesives (ECAs).- Die Attach Adhesives and Films.- Thermal Interface Materials.- Embedded Passives.- Nanomaterials and Nanopackaging.- Wafer Level Chip Scale Packaging.- Microelectromechanical Systems and Packaging.- LED and Optical Device Packaging and Materials.- Digital Health and Bio-Medical Packaging.

Produkt-Details

• Erscheint lt. Verlag: 10.12.2008
• Zusatzinfo: 300 Illustrations, black and white; XII, 724 p. 300 illus.
• Verlagsort: New York, NY
• Sprache: englisch
• Maße: 155 x 235 mm
• Themenwelt: Technik ► Elektrotechnik / Energietechnik
• Themenwelt: Technik ► Maschinenbau
• ISBN-10: 0-387-78218-4 / 0387782184
• ISBN-13: 978-0-387-78218-8 / 9780387782188
• Zustand: Neuware