Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
Springer Verlag, Singapore
978-981-95-6890-1 (ISBN)
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This book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging, has published more than 530 peer-reviewed papers (385 are the principal investigator), 52 issued and pending US patents (31 are the principal inventor), and 24 textbooks. John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow and has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share. Professor K.N. Chiang received his Ph.D. from the Georgia Institute of Technology in the United States. He is the chair professor at the National Tsing Hua University in Hsinchu, Taiwan. After graduating from Georgia Tech, he worked for four years as a senior researcher at MSC/NASTRAN, a world-famous finite element system. From 2010 to 2013, he served as a general director of the National High-Performance Computing Center, which is the National Strategic Research Center of Taiwan. He has received outstanding research awards from the Ministry of Science and Technology of Taiwan three times and has published more than 450 technical papers in international journals and conference proceedings. He has been granted more than 50 invention patents. Among the major awards Professor Chiang received are the Excellence in Mechanics Award from ASME-EPPD (2022) and the Outstanding Sustained Technical Contribution Award (2020) from IEEE-EPS.
Advanced Packaging.- Cu Hybrid Bonding.- Glass Packaging.- CoPackaged Optics (CPO).- Characterization of Low Loss Dielectric Materials for Speed and Frequency Applications.- Fatigue and Fracture Models for Electronic Packaging.- AI and Machine Learning Algorithms.- Modeling and Design Simulation Technology.- Integrating AI with Design Simulation for Advanced Packaging.
| Erscheint lt. Verlag | 5.3.2026 |
|---|---|
| Zusatzinfo | 50 Illustrations, black and white |
| Verlagsort | Singapore |
| Sprache | englisch |
| Maße | 155 x 235 mm |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| ISBN-10 | 981-95-6890-0 / 9819568900 |
| ISBN-13 | 978-981-95-6890-1 / 9789819568901 |
| Zustand | Neuware |
| Informationen gemäß Produktsicherheitsverordnung (GPSR) | |
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