BSIM–SOI Industry-Standard Compact Model

Surface Potential-Based FET Model for RFIC Design

Chetan Kumar Dabhi, Debashish Nandi, Dinesh Rajasekharan, Chenming Hu, Yogesh Singh Chauhan (Autoren)

Buch | Softcover

350 Seiten

2026
Woodhead Publishing (Verlag)
978-0-443-43904-9 (ISBN)

Infos

BSIM–SOI Industry-Standard Compact Model: Surface Potential-Based FET Model for RFIC Design provides complete coverage of compact modeling and design techniques specific to SOI transistors. It is designed to be the first comprehensive guide that thoroughly explains the industry-standard BSIM-SOI compact model, along with the unique modeling and RF design techniques necessary for the accurate extraction and implementation of the industry standard BSIM-SOI model. BSIM-SOI is the most widely used compact model in the semiconductor industry. This book will equip designers, engineers, and researchers with the knowledge and tools required to optimize SOI-based circuit performance and system integration. The book explains the fundamental surface-potential calculations and addresses various real device effects, such as floating body, self-heating, and dynamic depletion effects, and layout influences, to accurately replicate realistic device behavior. Additionally, the step-by-step parameter extraction procedures for the BSIM-SOI model are outlined and the results of benchmark tests are also presented. This book will be a valuable reference for the expanding field of SOI technology, catering specifically to circuit designers, device engineers, academic researchers, and students.

Autor

Chetan Kumar Dabhi is a Staff Engineer at pSemi Corporation, San Diego, United States. He specializes in developing and supporting industry-standard compact models for diverse semiconductor devices, including SOI FETs, FinFETs, and Bulk FETs (BSIM-SOI, BSIM-IMG, BSIM-BULK, and BSIM4). Debashish Nandi is a Researcher in the Department of Electrical Engineering at the Indian Institute of Technology Kanpur, India. His research focuses on compact modelling and device characterization of various nanoscale devices, primarily SOI MOSFETs for RF applications for advanced communication standards like 5G and 6G. Dinesh Rajasekharan is a Postdoctoral Researcher in the BSIM group at the University of California Berkeley, United States. His research covers semiconductor device compact model development, neuromorphic computing using emerging semiconductor devices, and using neural networks in electronics applications. Chenming Hu is TSMC Distinguished Chair Professor Emeritus at the University of California Berkeley, United States. He was the Chief Technology Officer of TSMC. He received the US Presidential Medal of Technology and Innovation from Pres. Barack Obama for developing the first 3D thin-body transistor FinFET, MOSFET reliability models and leading the development of BSIM industry standard transistor model that is used in designing most of the integrated circuits in the world. He is a member of the US Academy of Engineering, the Chinese Academy of Science, and Academia Sinica. He received the highest honor of IEEE, the IEEE Medal of Honor, and its Andrew Grove Award, Solid Circuits Award, and the Nishizawa Medal. He also received the Taiwan Presidential Science Prize and UC Berkeley’s highest honor for teaching – the Berkeley Distinguished Teaching Award. Yogesh Singh Chauhan is a Chair Professor in the Department of Electrical Engineering at the Indian Institute of Technology Kanpur, India. He is the developer of several industry standard models: ASM-HEMT, BSIM-BULK (formerly BSIM6), BSIM-CMG, BSIM-IMG, BSIM4 and BSIM-SOI models. His research group is involved in developing compact models for GaN transistors, FinFET, nanosheet/gate-all-around FETs, FDSOI transistors, negative capacitance FETs and 2D FETs. His research interests are RF characterization, modeling, and simulation of semiconductor devices. Ananth Sundaram is a Deputy Director at GlobalFoundries, Bengaluru, India. He is a technology professional with experience in semiconductor modeling, design, and measurement.

Inhalt

1. General overview of SOI models and technology trends
2. Core model formulation
3. Real device effects
4. Terminal charges and capacitances
5. Leakage currents
6. Noise models in BSIM-SOI
7. Body contact parasitics – modeling approach
8. Self-Heating and Temperature Effects
9. Cutting-Edge RF Modeling and Validation Techniques
10. Integrating BSIM-SOI Models in Analog, Digital, and RF Designs
11. Parameter Extraction
12. Model Quality testing

Produkt-Details

• Erscheint lt. Verlag: 1.7.2026
• Reihe/Serie: Woodhead Publishing Series in Electronic and Optical Materials
• Sprache: englisch
• Maße: 152 x 229 mm
• Themenwelt: Technik ► Elektrotechnik / Energietechnik
• Themenwelt: Technik ► Maschinenbau
• ISBN-10: 0-443-43904-4 / 0443439044
• ISBN-13: 978-0-443-43904-9 / 9780443439049
• Zustand: Neuware