Stochastic Finite Element Modeling in Electronic Packaging
Wiley-IEEE Press (Verlag)
978-1-394-35294-4 (ISBN)
- Noch nicht erschienen (ca. April 2026)
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In Stochastic Finite Element Modeling in Electronic Packaging, distinguished researcher Liu Chu delivers an expert discussion of the latest advanced numerical methods and modeling techniques specific to electronic packaging. The book supplements its explanations with original MATLAB and ANSYS (APDL) code that can be applied immediately. It also includes robust examples that draw on a comprehensive description of the mechanics of electronic packaging modeling.
Chu explains the fundamentals of modeling logic and concepts in an accessible way that is ideal for beginners to the topic. She demonstrates practical guides and benchmarks that will assist readers in the testing, measurement, and modeling of their own materials.
Readers will also find:
A thorough introduction to a modeling approach that focuses on digital twins and big data applications, including Monte Carlo Sampling
Comprehensive explorations of benchmarks, testing, measurement, and modeling
Practical discussions of theoretical finite element models in electronic packaging
Complete treatments of the fundamentals of modeling logic and concepts
Perfect for undergraduate and graduate students in electrical engineering and computer science, Stochastic Finite Element Modeling in Electronic Packaging will also benefit practicing electronic design engineers and academic researchers with an interest in electronic packaging and materials science.
Liu Chu, PhD, is a Senior Researcher in the School of Physical Science and Technology at ShanghaiTech University. Her research is primarily focused on uncertainty quantification in stochastic defects, numerical simulations for electronic packaging, and the development of advanced computational mechanics methods.
Chapter 1. Overview
Chapter 2. Electronic packaging
Chapter 3. Random Sampling Methods
Chapter 4. Random Fields and Stochastic Processes
Chapter 5. Reliability Prediction
Chapter 6. Finite element method
Chapter 7. Nonlinear Stochastic finite element method
Chapter 8. Random shear stress and thermal temperature
Chapter 9. Material uncertainty in electro-migration
Chapter 10. Mechanical reliability in the replaceable integrated chiplet assembly
Chapter 11. Kriging Surrogate Model
Chapter 12. Digital twins based on SFEM
| Erscheint lt. Verlag | 7.4.2026 |
|---|---|
| Sprache | englisch |
| Themenwelt | Mathematik / Informatik ► Mathematik ► Wahrscheinlichkeit / Kombinatorik |
| Technik ► Elektrotechnik / Energietechnik | |
| Technik ► Maschinenbau | |
| ISBN-10 | 1-394-35294-8 / 1394352948 |
| ISBN-13 | 978-1-394-35294-4 / 9781394352944 |
| Zustand | Neuware |
| Informationen gemäß Produktsicherheitsverordnung (GPSR) | |
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