EMBEDDED COOLING OF ELECTRONIC DEVICES (eBook)

Conduction, Evaporation, and Single- and Two-Phase Convection

Madhusudan Iyengar, Justin A Weibel, Mehdi Asheghi (Herausgeber)

eBook Download: EPUB

2024
480 Seiten
World Scientific Publishing Company (Verlag)
978-981-12-7938-6 (ISBN)

Infos

This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.

The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.

This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.

Contents:

• Compact Thermal Modeling of Emerging Cooling Technologies for Processors (Zihao Yuan, Sherief Reda, and Ayse K Coskun)
• Microscale Evaporation for High Heat Flux Applications (Damena D Agonafer, Mun Mun Nahar, Binjian Ma, Zhikai Yang, Quan H Chau, Erdong Song, Jorge Padilla, and Madhusudan Iyengar)
• Numerical Modeling of Embedded Two-Phase Cooling in Silicon Microelectronics (Daniel Lorenzini and Yogendra Joshi)
• Chip-Embedded Two-Phase Cooling (Timothy Chainer, Pritish Parida, and Mark Schultz)
• Embedded Cooling of High-Power RF Amplifiers (John Ditri)
• Thermal Characteristics and Management Scheme of Self-Emissive and Liquid Crystal Displays (Sungki Kim)
• Advances in Materials Engineering for Conduction-limited Direct Contact Cooling (Arden L Moore)
• Monolithic Microfluidic Cooling Using Micropin-Fin Arrays for Local High Heat Flux Remediation: Design Considerations, Experimental Validation, and FPGA Integration (Thomas Sarvey, Ankit Kaul, and Muhannad S Bakir)
• Recent Experimental and Modeling Advances in Two-Phase Embedded Microfluidic Cooling (Todd A Kingston, Justin A Weibel, and Suresh V Garimella)
• Scaling Limits, Challenges, and Opportunities in Embedded Cooling (Srikanth Rangarajan, Scott N Schiffres, and Bahgat Sammakia)
• Co-Design of Thermal and Electromagnetics for Development of Light and Ultrahigh Efficiency Electric Motors (Ziaur Rahman, Michael Ohadi, and David Deisenroth)

Readership: Electrical, packaging and thermal engineers, as well as Mechanical Engineering and Electronic Engineering MS and PhD students interested to understand and collaboratively tackle the complex and multidisciplinary field of microelectronics device (embedded) cooling.

Key Features:

• This book is a good starting point for electrical and thermal engineers and MS and PhD students interested in microelectronics cooling
• It highlights the frontiers in the research and development of high-performance embedded cooling for 2D/3D heterogeneous integrated chips
• It also includes a deep dive into the fundamental physics of conduction and evaporation
• The book also covers the emerging and fast-growing field of thermal engineering

Produkt-Details

• Erscheint lt. Verlag: 10.1.2024
• Reihe/Serie: WS SERIES IN ADV INTEGRATION & PACKAGING
• Verlagsort: SG
• Sprache: englisch
• Themenwelt: Technik
• ISBN-10: 981-12-7938-1 / 9811279381
• ISBN-13: 978-981-12-7938-6 / 9789811279386