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Force Sensors for Microelectronic Packaging Applications

Buch | Hardcover
VIII, 178 Seiten
2004 | 2005
Springer Berlin (Verlag)
978-3-540-22187-6 (ISBN)

Lese- und Medienproben

Force Sensors for Microelectronic Packaging Applications - Jürg Schwizer, Michael Mayer, Oliver Brand
CHF 194,70 inkl. MwSt

Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

Sensor Design.- Measurement System.- Characterization.- Applications.- Conclusions and Outlook.

Erscheint lt. Verlag 21.10.2004
Reihe/Serie Microtechnology and MEMS
Zusatzinfo VIII, 178 p.
Verlagsort Berlin
Sprache englisch
Maße 155 x 235 mm
Gewicht 452 g
Themenwelt Technik Maschinenbau
Schlagworte Design • Development • Flip-Chip • Force sensor • Interconnect • Piezoresistivity • process monitoring • Quality Control, Reliability, Safety and Risk • Reliability • semiconductor • Sensor • Sensortechnik • Technologie • Technology • Verpackung • Wire bonding
ISBN-10 3-540-22187-5 / 3540221875
ISBN-13 978-3-540-22187-6 / 9783540221876
Zustand Neuware
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