Theory and Practice of Thermal Transient Testing of Electronic Components
Springer International Publishing (Verlag)
978-3-030-86173-5 (ISBN)
This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed tounderstand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.
lt;b> Márta Rencz, PhD, is a Professor and former Head of the Department of Electron Devices at the Budapest University of Technology and Economics. Dr. Rencz also holds a Research Director position with Mentor, a Siemens Business. She received her undergraduate and master degrees in electrical engineering and a PhD from the Technical University of Budapest, Hungary, the Doctor of Science degree from The Hungarian Academy of Science, and the Doctor Honoris Causa Degree from the Technical University of Tallinn. Her latest research interests include the thermal investigation of ICs and MEMS, thermal sensors, thermal testing, thermal simulation, multiphysics model generation, and electro-thermal simulation. Dr. Rencz received the Harvey Rosten Award of Excellence for her research results in thermal modelling and the ASME Allan Krauss Thermal Management Medal for her contributions to the scientific and academic world of thermal transient testing, in particular, her work on thermal metrology including thermal test, characterization, and analysis of semiconductor devices and packages. She is Program Committee member for several international conferences and workshops and a guest editor of special issues at leading scientific journals. She has published her theoretical and practical results in more than 350 technical papers.
Introduction: the Importance and Motivation.- Theoretical Background: History, the Network Identification by Deconvolution (NID) Method, Structure Functions, the Thermal Signature.- The Use of Thermal Transient Testing.- General Practical Questions and the Flow of Thermal Transient Measurements.- On the Accuracy and Repeatability of Thermal Measurements.
| Erscheinungsdatum | 25.01.2023 |
|---|---|
| Zusatzinfo | IX, 385 p. |
| Verlagsort | Cham |
| Sprache | englisch |
| Maße | 155 x 235 mm |
| Gewicht | 712 g |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| Technik ► Maschinenbau | |
| Schlagworte | Bipolar Transistors • Capacitors • IGBT devices • LEDs • MOS Transistors • Reliability Testing • resistors • Si diodes • Structure integrity testing • thermal characterization • thermal testing • thermal transient testing • Wide bandgap materials |
| ISBN-10 | 3-030-86173-2 / 3030861732 |
| ISBN-13 | 978-3-030-86173-5 / 9783030861735 |
| Zustand | Neuware |
| Informationen gemäß Produktsicherheitsverordnung (GPSR) | |
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