Lead-free Soldering Process Development and Reliability (eBook)
512 Seiten
John Wiley & Sons (Verlag)
978-1-119-48193-5 (ISBN)
Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production.
Among other topics, the book addresses:
· Developments in process engineering (SMT, Wave, Rework, Paste Technology)
· Low temperature, high temperature and high reliability alloys
· Intermetallic compounds
· PCB surface finishes and laminates
· Underfills, encapsulants and conformal coatings
· Reliability assessments
In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book's explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers.
Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.
JASBIR BATH, is the owner of Bath Consultancy LLC which provides consulting and training services in the electronics manufacturing industry. He was the Corporate Lead Engineer with Solectron Corporation/ Flex for ten years with a role involving tin-lead and lead-free solder process development. Previously he was a Technical Officer at ITRI (International Tin Research Institute/ Tin Technology) Ltd in the U.K.
Chapter 1: Lead-Free Surface Mount Technology
Chapter 2: Wave/Selective Soldering
Chapter 3: Lead-free Rework
Chapter 4: Solder Paste and Flux Technology
Chapter 5: Low Temperature Lead-free Alloys and Solder Pastes
Chapter 6: High Temperature Lead-Free Bonding Materials-the need, the potential candidates and the challenges
Chapter 7: Lead (Pb)-Free Solders for High Reliability and High-Performance Applications
Chapter 8 - Lead-free Printed Wiring Board Surface Finishes
CHAPTER 9 - PCB Laminates (Including High Speed Requirements)
Chapter 10: Underfills and Encapsulants Used in Lead-Free Electronic Assembly
Chapter 11: Thermal Cycling and General Reliability Considerations
Chapter 12: Intermetallic Compounds
Chapter 13: Conformal Coatings
| Erscheint lt. Verlag | 23.6.2020 |
|---|---|
| Reihe/Serie | Wiley Series in Quality and Reliability Engineering | Wiley Series in Quality and Reliability Engineering |
| Sprache | englisch |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| Wirtschaft ► Betriebswirtschaft / Management | |
| Schlagworte | Bleifreies Löten • Component Manufacturing • Electrical & Electronics Engineering • Elektrotechnik u. Elektronik • Industrial Engineering • Industrial Engineering / Manufacturing • Industrielle Verfahrenstechnik • Komponentenfertigung • Löten • Produktion i. d. Industriellen Verfahrenstechnik • Qualität u. Zuverlässigkeit • Quality & Reliability |
| ISBN-10 | 1-119-48193-7 / 1119481937 |
| ISBN-13 | 978-1-119-48193-5 / 9781119481935 |
| Informationen gemäß Produktsicherheitsverordnung (GPSR) | |
| Haben Sie eine Frage zum Produkt? |
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