ISTFA 2019: Proceedings from the 45th International Symposium for Testing and Failure Analysis
Seiten
2020
A S M International (Verlag)
978-1-62708-273-0 (ISBN)
A S M International (Verlag)
978-1-62708-273-0 (ISBN)
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Presents papers from the 2019 ISTFA conference on “Novel Computing Architectures”. Topics include the advent of artificial intelligence and the promise of quantum computing that are driving disruptive computing architectures; and neuromorphic chip designs and quantum bits.
The theme for the 2019 ISTFA conference was Novel Computing Architectures. Papers include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
The theme for the 2019 ISTFA conference was Novel Computing Architectures. Papers include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
| Erscheinungsdatum | 24.08.2020 |
|---|---|
| Verlagsort | Materials Park, OH |
| Sprache | englisch |
| Gewicht | 1498 g |
| Themenwelt | Technik ► Maschinenbau |
| ISBN-10 | 1-62708-273-5 / 1627082735 |
| ISBN-13 | 978-1-62708-273-0 / 9781627082730 |
| Zustand | Neuware |
| Informationen gemäß Produktsicherheitsverordnung (GPSR) | |
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