Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

Asme (Autor)

Buch | Softcover

836 Seiten

2020
American Society of Mechanical Engineers,U.S. (Verlag)
978-0-7918-5932-2 (ISBN)

Infos

A printed collection of 90 full-length, peer-reviewed technical papers. Topics include Autonomous, Hybrid, and Electric Vehicles; Energy Conversion and Storage; Flexible and Wearable Electronics; Heterogeneous Integration; Photonics and Optics; and Power Electronics.

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Printed collection of 90 full-length, peer-reviewed technical papers. Topics include:

Autonomous, Hybrid, and Electric Vehicles
Energy Conversion and Storage
Flexible and Wearable Electronics
Heterogeneous Integration
Internet of Things
Photonics and Optics
Power Electronics
Servers of the Future, Edge and Cloud Computing: Papers Honoring Michael Ellsworth for Contributions and
Service to ASME InterPACK, the Electronic and Photonic Packaging Division, and Leadership in Liquid Cooling
of Server Systems

Produkt-Details

• Erscheinungsdatum: 03.03.2020
• Verlagsort: Fairfield
• Sprache: englisch
• Themenwelt: Technik ► Maschinenbau
• ISBN-10: 0-7918-5932-0 / 0791859320
• ISBN-13: 978-0-7918-5932-2 / 9780791859322
• Zustand: Neuware