Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
Kluwer Academic Publishers (Verlag)
978-1-4020-7330-4 (ISBN)
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
1 Introduction.- 1.1 Numerical Modeling with Finite Element Analysis.- 1.2 Constitutive Relations.- 1.3 Failure Prediction.- 1.4 References.- 2 Thermomechanical Fatigue Life Prediction Analysis.- 2.1 Approach.- 2.2 Analysis Steps.- 2.3 Case Study: BGA-Type Package.- 2.4 References.- 3 Mechanical Bending Fatigue Life Prediction Analysis.- 3.1 Approach.- 3.2 Analysis Steps.- 3.3 Case Study: BGA-Type Package.- 3.4 References.- 4 Macro Reference Library.- 4.1 Overview.- 4.2 Preprocessor.- 4.3 Solution.- 4.4 Postprocessing.- 4.5 Reference.- Appendix A: Installation and Execution.- A.1 Steps for ReliANS Installation on a PC Platform.- A.2 Steps for Adding Working Directories for Use in ReliANS.- A.3 Demonstration of ReliANS Installation and Adding New Directories.- A.4 Installation of ReliANS on UNIX Systems.- Appendix B: Input Listings for Case Studies.- B. 1 Input Listing for the Case Study Given in Chapter 2.- B.2 Input Listing for the Case Study Given in Chapter 3.
| Reihe/Serie | The Springer International Series in Engineering and Computer Science ; 719 |
|---|---|
| Zusatzinfo | XX, 185 p. |
| Sprache | englisch |
| Maße | 155 x 235 mm |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| Technik ► Maschinenbau | |
| ISBN-10 | 1-4020-7330-5 / 1402073305 |
| ISBN-13 | 978-1-4020-7330-4 / 9781402073304 |
| Zustand | Neuware |
| Informationen gemäß Produktsicherheitsverordnung (GPSR) | |
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