Practical Guide to the Packaging of Electronics
Thermal and Mechanical Design and Analysis
Seiten
2002
Marcel Dekker Inc (Verlag)
978-0-8247-0865-8 (ISBN)
Marcel Dekker Inc (Verlag)
978-0-8247-0865-8 (ISBN)
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Taking a simple approach to estimating thermal and mechanical characteristics of electronic systems, this reference emphasizes reliability problems and the design of systems with incomplete criteria and components. It contains topics such as packaging design and reliability and thermal, junction-to-case, and contact interface resistance.
Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems.
Practical Guide to the Packaging of Electronics discusses
Packaging/enclosure design and reliability
Thermal, junction-to-case, and contact interface resistance
Direct and indirect flow system design
Fin design and fan selection
Vital elements of shock and vibration
Thermal stresses and strains in the design and analysis of mechanically reliable systems
Reliability models and system failure
The selection of engineering software to facilitate system analysis
Design parameters in an avionics electronics package
Practical Guide to the Packaging of Electronics is an excellent refresher for mechanical, biomedical, electrical and electronics, manufacturing, materials, and quality and reliability engineers, and will be an invaluable text for upper-level undergraduate and graduate students in these disciplines.
Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems.
Practical Guide to the Packaging of Electronics discusses
Packaging/enclosure design and reliability
Thermal, junction-to-case, and contact interface resistance
Direct and indirect flow system design
Fin design and fan selection
Vital elements of shock and vibration
Thermal stresses and strains in the design and analysis of mechanically reliable systems
Reliability models and system failure
The selection of engineering software to facilitate system analysis
Design parameters in an avionics electronics package
Practical Guide to the Packaging of Electronics is an excellent refresher for mechanical, biomedical, electrical and electronics, manufacturing, materials, and quality and reliability engineers, and will be an invaluable text for upper-level undergraduate and graduate students in these disciplines.
Introduction
Basic Heat Transfer: Conduction, Convection and Radiation
Conductive Cooling
Radiation Cooling
Fundamentals of Convection Cooling
Basics of Shock and Vibration
Introduction to Finite Element Method
Design and Analysis for Mechanically Reliable Systems
Electrical Reliability
Some Analysis Tips in Using Finite Element Methods
Design Considerations in an Avionics Electronic Package
References
Index
| Erscheint lt. Verlag | 8.10.2002 |
|---|---|
| Verlagsort | New York |
| Sprache | englisch |
| Maße | 216 x 279 mm |
| Gewicht | 408 g |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| ISBN-10 | 0-8247-0865-2 / 0824708652 |
| ISBN-13 | 978-0-8247-0865-8 / 9780824708658 |
| Zustand | Neuware |
| Haben Sie eine Frage zum Produkt? |
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