ISTFA 2001

International Symposium for Testing and Failure Analysis

Media-Kombination

550 Seiten

2001
ASM International
978-0-87170-746-8 (ISBN)

Infos

Proceedings of the 27th International Symposium for Testing and Failure Analysis, 11-15 November 2001, Santa Clara, California. This proceedings volume presents in-depth coverage of the latest developments and the most advanced techniques for microelectronics failure analysis. The CD-ROM provides the complete content of the book in searchable Adobe Acrobat PDF format. Contents include: Advanced techniques Packaging Backside analysis Scanning probe microscopy Focused ion beam (FIB) techniques Failure analysis of micro-electromechanical systems (MEMS) Yield improvement Discretes Defect-based testing Case histories.

Produkt-Details

• Verlagsort: Ohio
• Sprache: englisch
• Maße: 156 x 230 mm
• Themenwelt: Technik ► Elektrotechnik / Energietechnik
• Themenwelt: Technik ► Maschinenbau
• ISBN-10: 0-87170-746-2 / 0871707462
• ISBN-13: 978-0-87170-746-8 / 9780871707468
• Zustand: Neuware