Handbook of Electronic Package Design

Michael Pecht (Autor)

Buch | Hardcover

892 Seiten

1991
Crc Press Inc (Verlag)
978-0-8247-7921-4 (ISBN)

Artikel merken

Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development

Michael Pecht

"Introduction, Michael D. Osterman and Michael Pecht Electronic Components, Denise BurkusHarris, Michael Pecht, and Pradeep Lall Printed Wiring Board Design and Fabrication, Denise Burkus Harris and Pradeep Lall Electronic Assemblies, Denise Burkus Harris Interconnections and Connectors, Pradeep Lall and Michael Pecht Layout, Michael D. Osterman and Michael Pecht Thermal Design Analysis, Dennis K. Karr, David Dancer, and Milton Palmes, III Thermomechanical Analysis and Design, Abhijit Dasgupta Vibration and Shock Analysis and Design, Donald B. Barker Humidity and Corrosion Analysis and Design, Wing C. Ko and Michael Pecht Design for Reliability, Michael Pecht Electronic Materials and Properties, Jillian Y. Evans and John W. Evans Appendix A: Acronyms Used in Electronics Appendix B: Glossary of Hybrid Microcircuits Packaging Terms Appendix C: Standards and Specifications for Microelectronics Appendix D: Standards and Specifications for PCBs and PWBs Appendix E: Unit Conversion Tables "

Erscheint lt. Verlag	16.8.1991
Reihe/Serie	Mechanical Engineering
Verlagsort	Bosa Roca
Sprache	englisch
Maße	174 x 246 mm
Gewicht	1830 g
Themenwelt	Technik ► Elektrotechnik / Energietechnik
ISBN-10	0-8247-7921-5 / 0824779215
ISBN-13	978-0-8247-7921-4 / 9780824779214
Zustand	Neuware