Smart Systems Integration 2018
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Smart systems integration has become a driving force behind almost all product innovation. Smart-enabled solutions can be found in almost every application field: transportation, health, manufacturing, the Internet of Things (IoT), energy, natural resources and security. Smart systems are developed by using key enabling technologies and by integrating the
knowledge from a variety of disciplines. They benefit from the progress in nanoelectronics design methods and tool develop ment. EPoSS – the European Platform on Smart Systems Integration has published its 2017 update of its Strategic Reasearch Agenda, defining research and industry priorities for the next 15 years to come. Additionally, this was also the input for the ECSEL MASRIA 2017. The Smart Systems Integration Conference and Exhibition serves as a communication
platform for academia, research and industry and enables the exchange of know-how in the field of smart systems integration. The conference addresses the application fields of smart systems as well as smart systems themselves, starting from the design via new building blocks for sensing, data processing, actuating, networking, and smart powering up to heterogeneous integration of the different building blocks and manufacturing of the systems.
For the first time, a session addresses embedded software – self-X systems. X stands for learning, organizing, adaptive but also for optimizing and repairing. As in previous years, EPoSS - the European Technology Platform on Smart Systems
Integration - is organizing two special sessions on the first day of the conference. Participation in these sessions is open to all interested delegates. New trends and technologies applied in industry are summarized in the SME session. The
advantages of ecosystems, e.g. Research Fab Microelectronics Germany, are presented in a special session as well.
The IOSENSE Spring School provided by TU Dresden organized by Mesago Messe Frankfurt takes place as co-located event next to the Smart Systems Integration 2018 at the Hilton Dresden.
The 12th Smart Systems Integration Conference 2018 will show a snapshot of the international work in the field of smart systems integration on an application and a basic research level. I’m looking forward to meeting you in Dresden.
Prof. Dr. Thomas Otto
Fraunhofer Institute for Electronic Nano Systems ENAS, DE
Conference chair, Smart Systems Integration 2018
Table of contents
Keynote
Assistive Robotics for public and AAL applications
Prof. Hans-Joachim Böhme, Sven Hellbach, University of Applied Sciences Dresden, DE
Conference Sessions
Session I: Printing Process
Launch to the market a truly portable Electrochemical Biosensor for Sulphite Analysis in Food Industry
Dr. Larraitz Añorga, Graciela Martinez-Paredes, Marc Parrilla, Elena Jubete,
Pedro J. Lamas-Ardisana, Hans-Jurgen Grande, Fundacion Cidetec, ES
Erlantz Ramos, Sandra Salleres, Arrate Jaureguibeitia, Asier Albizu, BIOLAN, ES
Open-access pilot line to accelerate industrial uptake of hybrid printed electronics
Dr. Maarten Cauwe, Imec Cmst, BE
Corne Rentrop, Holst Centre, NL
Laurence Clerc, CEA-LITEN, FR
Kimmo Keränen, VTT, FI
Tim Marsden, CPI, UK
Inkjet printing of patterned nanocarbon absorber layers for pyroelectric infrared detectors
Christian Zeiner, Maxim Polomoshnov, Maik Müller, Enrico Sowade, Technische Universität Chemnitz, DE
Armin Günther, Norbert Neumann, InfraTec GmbH, DE
Tobias Seifert, Thomas Blaudeck, Sascha Hermann, Reinhard R. Baumann, Technische Universität Chemnitz, DE
Maik Wiemer, Thomas Otto, Fraunhofer Institute for Electronic Nano Systems (ENAS), DE
Developing a Roll-to-Roll integration & conversion process for smart labels within the FMCG and pharmaceutical sectors
Tim Marsden, Centre for Process Innovation, UK
Simon Johnson, Neil Parker & Andrew Hamilton, UK
Session II: System Integration Technologies I
Development of micro dispense and jetting process of battery electrodes for the fabrication of substrate integrated micro batteries
Dr. Robert Hahn, Kevin Tribowski, Fraunhofer Institute for Reliability and Microintegration IZM, DE
Marc Ferch, Katrin Höppner, Krystan Marquardt, Klaus-Dieter Lang, TU Berlin, DE
Novel chip embedding and interconnection technology for mm-wave System-in-Package (SiP) applications
Christof Landesberger, A. Drost, R. Faul, W. Hell, S. Scherbaum, D. Bonfert, Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, DE
A. Ott, R. Hotopan, R. Böhnke, Sony Europe Limited, DE
Reactive bonding with oxide based reactive multilayers
Klaus Vogel, Frank Roscher, Maik Wiemer, Thomas Otto, Fraunhofer ENAS, Fraunhofer Institute for Electronic Nano Systems ENAS, DE
Sven Zimmermann, Technische Universität Chemnitz, DE
Reactive joining of sensitive materials for MEMS devices: characterization of joint quality
Irina Spies, Axel Schumacher, Stephan Knappmann, Alfons Dehé, Hahn-Schickard, DE
Bastian Rheingans, Roman Furrer, Jürg Neuenschwander, Jolanta Janczak-Rusch, Lars Jeurgens, Empa, CH
Session III: Advanced Technologies
Post-CMOS MEMS Capacitive Pressure Sensor: compatible porous ALD membrane for Sacrificial Layer Release and Diaphragm Sealing
Christian Walk, Özgü Dogan, Michael Görtz, Holger Vogt, Fraunhofer Institute for Microelectronic Circuits and Systems IMS, DE
Wilfried Mokwa, RWTH Aachen University, DE
Mechanically coupled capacitive ultrasonic transducer
Marcel Krenkel, Nicolas Lange, Sandro G. Koch, Marco Kircher, Fraunhofer Institute for Photonic Microsystems IPMS, DE
Fabrication and Operation of Protein-Powered Biocomputation using Nanostructured Networks
Dr. Christoph Meinecke, D. Reuter, St. E. Schulz, Technische Universität Chemnitz, DE
G. Heldt, Fraunhofer Institute for Electronic Nanosystems (ENAS), DE
T. Korten, St. Diez, Technische Universität Dresden, DE
Analysis of resonance frequency and sensitivity on III-Nitride SAW based temperature sensors
Dr. Ioana Zdru, IMT Bucharest, RO
Session IV: System Integration Technologies II
3D Wire - a novel approach for 3D Chips Interconnection for Harsh Environment Applications
Jan Bickel, O. Pohl, H.-D. Ngo, University of Applied Sciences Berlin, DE
X. Hu, Technische Universität Berlin, DE
T. Weiland, P. Mackowiak, O. Ehrmann, M. Schneider-Ramelow, K.-D. Lang, Fraunhofer Institute for Reliability and Microintegration IZM, DE
Fabrication of 3D Ceramic Interconnect Devices by Laser Induced Selective Metallization
Eugen Ermantraut, A. Zimmermann, P. Ninz, F. Kern, R. Gadow, University of Stuttgart, DE
H. Müller, M. Wolf, W. Eberhardt, Hahn-Schickard, DE
Selective over molding of a CMos TSV wafer with the flexible 3D integration of Sensors and Components
Ton van Weelden, Boschman Technologies B.V., NL
Mike Hoedemaker, Eef Boschman, Advanced Packaging Center, NL
A Functional 3D- and Inkjet-Printed Housing for a Capacitive Position Sensor in a Spectrometer Application
Lisa-Marie Faller, Hubert Zangl, Alpen-Adria-Universität Klagenfurt, AT
Matic Krivec, Carinthia Tech Research, AT
Session V: SME session
Development of a new vacuum gauge based on Si MEMS structure
Stepan Konakov, Irina Popova, Maxim Fedorov, Oleg Rakityansky, Vladimir Ivanov, Gyrooptics, RU
Vladimir Gorobey, Roman Teteruk, Rustam Kuvandykov, Alexander Garshin. D.I. Mendeleyev Institute for Metrology, RU
Solmates Pulsed Laser Deposition systems enable the integration of critical novel thin film materials for the MEMS & 5G market
Dr. Matthijn Dekkers, Solmates B.V., NL
nCapsulate, added value for system assembly
Ignas van Dommelen, Sencio BV, NL
Ensuring sensor reliability by System Level Testing
Ingolf Leidert, SPEKTRA Schwingungstechnik und Akustik GmbH Dresden, DE
Session VI: Self-X Systems
The Learning of the OpenLicht System, a self-learning Lighting System at the Edge of the Network
Kay Bierzynski, Pavel Lutskov, Juan Mena Carrillo, Infineon Technologies AG, DE
René Schöne, Uwe Aßmann, TU Dresden, DE
Computing within Materials: Self-Adaptive Materials and Self-organizing Agents
Dr. Stefan Bosse, Atra Gemilang, Universität Bremen, DE
Dirk Lehmhus, Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, DE
Management strategy: Towards a holistic platform for runtime adaptation and reconfiguration of building automation systems
Tuan Linh Mai, Matthias Lehmann, Bastian Wollschlaeger, Klaus Kabitzsch, Technische Universität Dresden Institut für Angewandte Informatik, DE
Session VII: Ecosystems
Standardisation of Smart Systems Building Blocks: A requirement for a globally competitive Cooperative Foundry
Petra Weiler, VDI/VDE Innovation + Technik GmbH, DE
Arndt Steinke, CiS Forschungsinstitut für Mikrosensorik GmbH, DE
Dag Andersson, Swerea IVF AB, SE
Cees J.M. Lanting, DATSA Belgium, BE
Research Fab Microelectronics Germany - a novel cooperation concept for jointly technology development
Jörg Amelung, Research Fab Microelectronics Germany FMD, DE
Optimized Ecosystem for effective Transfers of Research and Business Opportunities - The Bavarian Way
Dr. Klaus Funk, Zentrum Digitalisierung Bayern, DE
The gateone-project: a digital innovation hub accelerating innovation through ecosystem design and product trajectory
Dr. Régis Hamelin, G. Andrieux, Blumorpho, FR
I. Chartier, CEA-LETI, FR
B. Roustom, CSEM, CH
Th. Healy, UC, TYNDALL, IE
Z. Ali, TEESSIDE UNIVERSITY, UK
B. Legrand, CNRS-LAAS, FR
K. Mayora, IK4-Ikerlan, ES
M. Scholles, Fraunhofer – IPMS, DE
R. Guerre, VTT, FI
Session VIII: Smart Production
CoDesign for the Integration of Energy Harvesters and Antennas for highly integrated Cyber Physical Systems CPS
Uwe Maaß, C. Brockmann, J. Hefer, C., Fraunhofer Institute for Reliability and Microintegration IZM, DE
Robust Magnetic Sensors for availability-oriented Product-Service Systems
Dr. Rolf Slatter, Sensitec GmbH, DE
Autonomous robots and the Internet of Things in Underground Mining
Frederic Güth, F. Wolf, H. Mischo, Y. Joseph, S. Grehl, R. Lösch, B. Jung, S. Varga, J. Benndorf, N. Rezaei Abadchi, A. Rehkopf, TU Bergakademie Freiberg, DE
Smart sensor for pneumatic combined clutch and brake
Maria Tijero, K. Mayora, J. Berganzo, I. Aramburu, E. Arroyo-Leceta, IK4-IKERLAN, ES
M. Anasagasti, M. Mondragón, Goizper, ES
D. Hoffmann, D. Stojakov, Hahn-Schickard, DE
Visualization and Process Control with Real-Time production information and IoT-based Maintenance workflows with Augmented Reality in the digital factory
Björn Schuster, N+P Informationssysteme GmbH, DE
Session IX: New Materials for Micro and Nano Systems
Sputter Epitaxy of Pb(Zr,Ti)O3 and Pb(Mg1/3,Nb2/3)O3-PbTiO3 Thin Films on Si for High-Performance Piezoelectric MEMS
Dr. Shinya Yoshida, Shuji Tanaka, Tohoku University, JP
Enhanced optoelectronic property of ultra-thin Al-doped ZnO layers by inserting nano-Ag particles on roughed surface of seed layer
Prof. Yen-Sheng Lin, Ze-Syue Wu, I-Shou University, TW
Joachim Mayer, Aachen University of Technology, DE
Scaling up Integration of Carbon Nanotubes into Micro-Electro-Mechanical Systems
Simon Böttger, Nathanael Jöhrmann, Jens Bonitz, Bernhard Wunderle, Stefan E. Schulz, Sascha Hermann, Technische Universität Chemnitz, DE
Integration of one-dimensional gas sensitive nanostructures grown via chemical vapor deposition into microdevices
Prof. Dr. Carles Cané, S. Vallejos, M.Tomic, I. Gràcia, E. Figueras, Instituto de Microelectrónica de Barcelona IMB-CNM (CSIC), ES
O. Chmela, J. Hubalek, Brno University of Technology, CZ
G. Domènech, D. Prades, A. Romano-Rodriguez, Universitat de Barcelona (UB), ES
S. Barth, Technische Universität Wien, AT
Capacitive Humidity Sensor based Nanograss Polyimide for Implementation in Various Applications
Dr. Jamila Boudaden, Fraunhofer Institute for Reliability and Microintegration IZM, DE
Session X: Design of smart integrated systems I
Generic Integrated Forensic Toolbox (GIFT) for on-site CBRN investigation
Dr. Eric Moore, University College Cork Tyndall National Institute, IE
Impact of Inter-Wafer Variations on MEMS’ Fingerprints
Oliver Willers, Christopher Huth, Robert Bosch GmbH, DE
Jorge Guajardo, Robert Bosch LLC, US
Helmut Seidel, Saarland University, DE
A new generation of low-cost and highly reliable CO2 gas sensors
Matthias Eberl, Franz Jost, Stefan Kolb, Rainer Schaller, Albrecht Thomas, Wolfgang Dettmann, Infineon Technologies AG, DE
Robert Weigel, University of Erlangen-Nuremberg, DE
Super-Low-Power Chip Design for Smart Sensors
Dr. Gerd Teepe, Globalfoundries Dresden Module Two LLC & Co. KG, DE
Smart Models for MEMS Microphone Transducers
Guido Janßen, X-FAB Semiconductor Foundries AG, DE
Session XI: Smart Systems Application
Defect Detection in high Quality Polymers used in the Smiconductor Manufacturing Industry
Dr. Christina Hirschl, T. Arnold, T. Moldaschl, L. Neumaier, M. Kraft, M. De Biasio, CTR Carinthian Tech Research AG, AT
S. Meislitzer, Meislitzer Präzisionstechnik GmbH, AT
Albert Molzbichler, Heinz Cramer, Lam Research AG Austria, AT
G. Oreski, PCCL Polymer Competence Center Leoben, AT
Considerations on Solar Energy Harvesting for Smart Systems
Astrid Della Mea, Hubert Zangl, Juliana Padilha Leitzke, Alpen-Adria-Universität Klagenfurt, AT
Development of a lab-on-chip electrochemical immunosensor for detection of Polycyclic Aromatic Hydrocarbons (PAH) in environmental water
Shifa Felemban, Patricia Vazquez, Eric Moore, University College Cork Tyndall National Institute, IE
UWB Radar sensor characterization for obstacle detection with application to the smart white cane
Laurent Ouvry, O. Debicki, S. Lesecq, J. Foucault, Univ. Grenoble Alpes, CEA-Léti, FR
Session XII: Test and Reliability Methodologies
Security beyond Design: Embedding Roots-of-Trust in Silicon and Cryptographically Securing the Supply Chain from Design to Manufacturing
Sean Riley, Data I/O Corporation, US
A technology toolbox concept to improve reliability evaluation
Daniel Hahn, Kathleen Jerchel, Olaf Wittler, Fraunhofer Institute for Reliability and Microintegration IZM, DE
Stefan Straube, Klaus-Dieter Lang, Technische Universität Berlin, DE
On the Thermo-Mechanical Risk Assessment of Complex Printed Circuit Boards (PCB) by Finite Element Modelling and Warpage Measurements
Jan Albrecht, Birgit Braemer, Marcus Hildebrandt, Pauline Taubert, Eberhard Kaulfersch, Sven Rzepka, Fraunhofer-Institut für Elektronische Nanosysteme, DE
Warpage Measurement on Bonded Wafers Under Thermal Load
Bastian Tröger, Dr. Thomas Fries, FRT GmbH, DE
Dirk Wünsch, Marcus Hildebrandt, Pauline Taubert, Dr. Knut Gottfried, Fraunhofer-Institut für Elektronische Nanosysteme, DE
Session XIII: Design of smart integrated systems II
On Designing Wireless Building Automation Networks: Estimating the Network Layer Impact of Functional Designs
Bastian Wollschlaeger, Klaus Kabitzsch, Technische Universität Dresden, DE
Andreas Willig, University of Canterbury, NZ
New Advancements in Using Statistical Models as Part of a Standard MEMS Design Flow
Christine Dufour, Coventor Inc., FR
Christof Hielscher, Tobias Bräuner, X-FAB Semiconductor Foundries AG, DE
Steve Breit, Gerold Schröpfer, Coventor, a Lam Research Company, US
Characterization of a 2D micro-conveyance device based on digital actuators
Dr. Zhichao Shi, Laurent Petit, Christine Prelle, Frédéric Lamarque, Jérémy Terrien, Université de Technologie de Compiègne, FR
Emile Martincic, Johan Moulin, Elie Lefeuvre, CNRS, Université Paris Sud, FR
Improving the Selectivity of Vapor Trace Detection System
Prof. Dr. Drago Strle, Mario Trifkovič, University of Ljubljana, SL
Anton Gradišek, Marion van Midden, Nace Pintar, Igor Muševič, Jozef Stefan Institute, SL
Poster Session
| Zusatzinfo | zahlreiche Abbildungen und Tabellen |
|---|---|
| Sprache | englisch |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| Schlagworte | Integration • Nano Systems • security • Smart Systems |
| ISBN-10 | 3-95735-082-4 / 3957350824 |
| ISBN-13 | 978-3-95735-082-4 / 9783957350824 |
| Zustand | Neuware |
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