Development of Sub-mm Wave Flip-Chip Interconnect
Seiten
2016
Cuvillier Verlag
978-3-7369-9410-2 (ISBN)
Cuvillier Verlag
978-3-7369-9410-2 (ISBN)
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With the increasing availability of MMICs at high frequencies beyond 100 GHz low-loss interconnects for module fabrication become essential. This work presents the results of the flip-chip interconnects approach exhibiting bandwidths from 220 GHz up to 500 GHz.
Flip-chip transitions in this study were fabricated based on simulated 3D models in three different topologies: coplanar-to-coplanar, stripline-to-coplanar, and stripline-to-stripline. The interconnects were realized with 10 µm-diameter AuSn microbumps. After the flip-chip mounting, scattering parameter measurements were performed to characterize the interconnect quality. The results suggest that the flip-chip technology is currently the most suitable technology for the high frequency range.
Flip-chip transitions in this study were fabricated based on simulated 3D models in three different topologies: coplanar-to-coplanar, stripline-to-coplanar, and stripline-to-stripline. The interconnects were realized with 10 µm-diameter AuSn microbumps. After the flip-chip mounting, scattering parameter measurements were performed to characterize the interconnect quality. The results suggest that the flip-chip technology is currently the most suitable technology for the high frequency range.
| Erscheinungsdatum | 22.12.2016 |
|---|---|
| Reihe/Serie | Innovationen mit Mikrowellen und Licht ; 38 |
| Sprache | englisch |
| Einbandart | Paperback |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| Technik ► Nachrichtentechnik | |
| Schlagworte | High-Frequency Applications • Process Technology • Sub-mm Wave Flip-Chip Interconnect |
| ISBN-10 | 3-7369-9410-9 / 3736994109 |
| ISBN-13 | 978-3-7369-9410-2 / 9783736994102 |
| Zustand | Neuware |
| Informationen gemäß Produktsicherheitsverordnung (GPSR) | |
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