Reliability, Stress Analysis, and Failure Prevention Issues in Adhesive and Bolted Connections - 1999

Buch | Softcover

1999
American Society of Mechanical Engineers,U.S. (Verlag)
9780791816592 (ISBN)

Infos

Contains the 16 papers presented at the November 1999 symposium. The topics include temperature distribution in a VLSI chip due to dynamic power density, the strength of joints combining adhesives with bolts, optimization of adhesively bonded single lap joints by adhered notching, and estimation of

Produkt-Details

• Erscheint lt. Verlag: 30.10.1999
• Zusatzinfo: illustrations
• Verlagsort: Fairfield
• Sprache: englisch
• Themenwelt: Technik ► Maschinenbau
• ISBN-13: 9780791816592 / 9780791816592
• Zustand: Neuware