Lead Free Solder
Mechanics and Reliability
Seiten
2014
Springer-Verlag New York Inc.
978-1-4899-9116-4 (ISBN)
Springer-Verlag New York Inc.
978-1-4899-9116-4 (ISBN)
Lead-free solders play a crucial role in the electronics industry. Featuring in-depth design and reliability information on lead-free deformation and failure analysis, this book covers a wide range of topics including advanced material mechanics theory.
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.
Introduction.- Theory on Mechanics of Solder Materials.-Mechanical Properties and Constitutive Models.- Fatigue Life Prediction Models.- Finite Element Analysis and Design-For-Reliability.- Thermo-Mechanical Reliability Test and Analysis.- Dynamic Mechanical Reliability Test and Analysis.- Thermal Cycling Aging Effects on Board-Level Drop Test Result
| Erscheint lt. Verlag | 30.10.2014 |
|---|---|
| Zusatzinfo | 162 Illustrations, black and white; X, 175 p. 162 illus. |
| Verlagsort | New York |
| Sprache | englisch |
| Maße | 155 x 235 mm |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| Technik ► Maschinenbau | |
| ISBN-10 | 1-4899-9116-6 / 1489991166 |
| ISBN-13 | 978-1-4899-9116-4 / 9781489991164 |
| Zustand | Neuware |
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