LED Packaging for Lighting Applications (eBook)

Design, Manufacturing, and Testing

Sheng Liu, Xiaobing Luo (Autoren)

eBook Download: EPUB

2011 | 1. Auflage
376 Seiten
John Wiley & Sons (Verlag)
978-0-470-82840-3 (ISBN)

Infos

Since the first light-emitting diode (LED) was invented by Holonyak
and Bevacqua in 1962, LEDs have made remarkable progress in the
past few decades with the rapid development of epitaxy growth, chip
design and manufacture, packaging structure, processes, and
packaging materials. LEDs have superior characteristics such as
high efficiency, small size, long life, low power consumption, and
high reliability. The market for white LED is growing rapidly in
various applications. It has been widely accepted that white LEDs
will be the fourth illumination source to substitute the
incandescent, fluorescent, and high-pressure sodium lamps. With the
development of LED chip and packaging technologies, the efficiency
of high power white LED will broaden the application markets of
LEDs while changing the lighting concepts of our lives.

In LED Packaging for Lighting Applications, Professors
Liu and Luo cover the full spectrum of design, manufacturing, and
testing. Many concepts are proposed for the first time, and readers
will benefit from the concurrent engineering and co-design
approaches to advanced engineering design of LED products.

* One of the only books to cover LEDs from package design to
manufacturing to testing

* Focuses on the design of LED packaging and its applications
such as road lights

* Includes design methods and experiences necessary for LED
engineers, especially optical and thermal design

* Introduces novel LED packaging structures and manufacturing
processes, such as ASLP

* Covers reliability considerations, the most challenging problem
for the LED industry

* Provides measurement and testing standards, which are critical
for LED development, for both LED and LED fixtures

* Codes and demonstrations available from the book's
Companion Website

This book is ideal for practicing engineers working in design or
packaging at LED companies and graduate students preparing for work
in industry. This book also provides a helpful introduction for
advanced undergraduates, graduates, researchers, lighting
designers, and product managers interested in the fundamentals of
LED design and production.

Color version of selected figures can be found at
www.wiley.com/go/liu/led

Autor

Sheng Liu is a ChangJiang Professor of Mechanical Engineering at Huazhong University of Science and Technology. He holds a dual appointment at Wuhan National Laboratory for Optoelectronics, and has served as tenured faculty at Wayne State University. He has over 14 years experience in LED/MEMS/IC packaging and extensive experience in consulting with many leading multi-national and Chinese companies. Liu was awarded the White House/NSF Presidential Faculty Fellowship in 1995, ASME Young Engineer Award in 1996, and China NSFC Overseas Young Scientist in 1999. He has been an associate editor for IEEE Trans. On Electronic Packaging Manufacturing since 1999 and an associate editor of Journal of Frontiers of Optoelectronics in China since 2007. He is currently one of the 11 National Committee Members in LED under Ministry of Science and Technology. He obtained a Ph.D. from Stanford in 1992, and got MS and BS in flight vehicle design, Nanjing University of Aeronautics and Astronautics, and he had three years industrial experience in China and USA. He has filed more than 70 patents in China and the USA, and has published more than 300 technical articles. Xiaobing Luo is a professor at Huazhong University of Science and Technology, Wuhan, China, with appointments at the School of Energy and Power Engineering and Wuhan National Lab for Optoelectronics. He received his Ph.D. in 2002 from Tsinghua University, China. He has also worked in Samsung Electronics in Korea as a Senior Engineer. His main research interests are LED, heat and mass transfer, microfluidics, MEMS, and sensors and actuators. He has published more than 60 papers and has applied for 40 patents in the USA, Korea, Japan, Europe and China.

Rezensionen

"The book will be useful as a resource for engineers in LED design
or packaging, and as an introduction to the field for advanced
students, researchers, lighting designers, and product managers."
(Book News, 1 October 2011)

Produkt-Details

• Erscheint lt. Verlag: 5.7.2011
• Sprache: englisch
• Themenwelt: Technik ► Elektrotechnik / Energietechnik
• Schlagworte: Electrical & Electronics Engineering • Electronic Packaging • Elektronikbauteile • Elektronische Baugruppe • Elektrotechnik u. Elektronik • Photonics & Lasers • Photonik u. Laser
• ISBN-10: 0-470-82840-4 / 0470828404
• ISBN-13: 978-0-470-82840-3 / 9780470828403