Microelectronic Applications of Chemical Mechanical Planarization (eBook)

Yuzhuo Li (Herausgeber)

eBook Download: PDF

2007 | 1. Auflage
760 Seiten
John Wiley & Sons (Verlag)
978-0-470-18089-1 (ISBN)

Infos

An authoritative, systematic, and comprehensive description of
current CMP technology

Chemical Mechanical Planarization (CMP) provides the greatest
degree of planarization of any known technique. The current
standard for integrated circuit (IC) planarization, CMP is playing
an increasingly important role in other related applications such
as microelectromechanical systems (MEMS) and computer hard drive
manufacturing. This reference focuses on the chemical aspects of
the technology and includes contributions from the foremost experts
on specific applications. After a detailed overview of the
fundamentals and basic science of CMP, Microelectronic Applications
of Chemical Mechanical Planarization:

* Provides in-depth coverage of a wide range of state-of-the-art
technologies and applications

* Presents information on new designs, capabilities, and emerging
technologies, including topics like CMP with nanomaterials and 3D
chips

* Discusses different types of CMP tools, pads for IC CMP, modeling,
and the applicability of tribometrology to various aspects of
CMP

* Covers nanotopography, CMP performance and defect profiles, CMP
waste treatment, and the chemistry and colloidal properties of the
slurries used in CMP

* Provides a perspective on the opportunities and challenges of the
next fifteen years

Complete with case studies, this is a valuable, hands-on resource
for professionals, including process engineers, equipment
engineers, formulation chemists, IC manufacturers, and others. With
systematic organization and questions at the end of each chapter to
facilitate learning, it is an ideal introduction to CMP and an
excellent text for students in advanced graduate courses that cover
CMP or related semiconductor manufacturing processes.

Autor

YUZHUO LI is a tenured professor in the Department of Chemistry and a member of the Center for Advanced Materials Processing (CAMP) at Clarkson University in Potsdam, New York. He is a member of the American Chemical Society, Chinese American Chemical Society, Materials Research Society, and The Electrochemical Society. He also holds guest professorships at several Chinese universities, including Yangzhou University and Sun Yat-Sen University.

Produkt-Details

• Erscheint lt. Verlag: 28.6.2008
• Sprache: englisch
• Themenwelt: Naturwissenschaften ► Chemie
• Themenwelt: Technik ► Elektrotechnik / Energietechnik
• Schlagworte: chemical engineering • Chemische Verfahrenstechnik • Components & Devices • Electrical & Electronics Engineering • Elektrotechnik u. Elektronik • Halbleiter • Komponenten u. Bauelemente • Mikroelektronik • semiconductors
• ISBN-10: 0-470-18089-7 / 0470180897
• ISBN-13: 978-0-470-18089-1 / 9780470180891