Physics and Chemistry of III-V Compound Semiconductor Interfaces
Kluwer Academic / Plenum Publishers (Verlag)
978-0-306-41769-6 (ISBN)
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The selection of authors was mandated by the desire to include both fundamental and practical approaches, covering device and material aspects of the interfaces. All of the authors are recognized experts on III-V interfaces and each has worked for many years in his subject area. This experience is projected in the breadth of understanding in each chapter.
1. III-V Semiconductor Surface Interactions.- 1. Introduction.- 2. Interface States and Schottky Barriers.- 3. Clean Surfaces of III-V Semiconductors.- 3.1. Crystallographic Structures of Surface and Bulk.- 3.2. Bulk and Surface Electronic States.- 3.3. Surface Imperfections and Defects.- 4. Adsorption of Gases on Clean III-V Semiconductors.- 4.1. General Introduction.- 4.2. Oxygen Adsorption.- 4.3. Chlorine on III-V Semiconductors.- 4.4. H2, H2S, and H2O Adsorption.- 5. Metal Films on Clean III-V Surfaces.- 5.1. General Introduction.- 5.2. Interactions at Very Small Coverages.- 5.2.1. Cesium on GaAs (110).- 5.2.2. Al, Ga, and In on GaAs and InP.- 5.2.3. Au and Ag on GaAs and InP.- 5.3. Interactions with Thick Metal Films.- 6. The Electrical Nature of Intimate Interfaces.- 6.1. Introduction.- 6.2. Abrupt Boundary Models.- 6.3. Nonabrupt Boundary Theories.- 7. Conclusions.- References.- 2. Schottky Diodes and Ohmic Contacts for the III-V Semiconductors.- 1. Introduction.- 2. Electrical Properties of Metal-Semiconductor Contacts.- 2.1. Classical Models of the Interface.- 2.1.1. Schottky Model.- 2.1.2. Bardeen Model.- 2.1.3. General Case.- 2.2. Mechanisms of Barrier Formation.- 2.3. Current Transport.- 2.3.1. Thermionic Emission: Rectification.- 2.3.2. Field Emission and Thermionic-Field Emission: Ohmic Behavior.- 2.4. Capacitance of a Schottky Diode.- 3. Schottky-Diode Technology.- 3.1. Measurement of ?B.- 3.1.1. Photoresponse Measurements.- 3.1.2. Current-Voltage Measurements.- 3.1.3. Capacitance-Voltage Measurements.- 3.2. Barrier Energies.- 3.2.1. GaAs.- 3.2.2. InP.- 3.2.3. Other Binary Compounds.- 3.2.4. III-V Alloys.- 4. Ohmic-Contact Technology.- 4.1. Methods of Forming Ohmic Contacts.- 4.1.1. Diffusion and Ion Implantation.- 4.1.2. Epitaxy.- 4.1.3. Alloying.- 4.1.4. Heterojunctions.- 4.2. Measurement of rc.- 4.2.1. Cox-Strack Method.- 4.2.2. Four-Point Method.- 4.2.3. Shockley Technique.- 4.2.4. Transmission-Line Model.- 4.3. Alloyed Ohmic Contacts.- 4.3.1. GaAs.- 4.3.2. InP.- 4.3.3. Other Binary Compounds.- 4.3.4. III-V Alloys.- References.- 3. The Deposited Insulator/III-V Semiconductor Interface.- 1. Introduction.- 2. General Overview of the Deposited Insulator/III-V Interface.- 3. Choice of Insulator and Deposition Technique.- 4. Interfacial Properties.- 4.1. Interfacial Reactions.- 4.2. Interfacial Oxide.- 4.3. Interdiffusion and Impurity Incorporation.- 4.4. Surface Evaporation.- 4.5. Energy of the Depositing Molecules.- 4.6. Interfacial Trapping and Instabilities.- 5. Experimental Results.- 5.1. InSb.- 5.2. GaAs.- 5.3. InP.- 6. Concluding Remarks.- References.- 4. Electrical Properties of Insulator-Semiconductor Interfaces on III-V Compounds.- 1. Introduction.- 2. Theoretical Background.- 2.1. Differential Surface Capacitance.- 2.2. Surface States.- 2.3. Surface Conductance.- 3. Gallium Arsenide.- 3.1. Chemically Clean Surface.- 3.2. Native Oxides.- 3.3. Deposited Insulators.- 4. Indium Antimonide.- 5. Indium Phosphide.- 5.1. Native Oxides.- 5.1.1. Thermally Grown Oxides.- 5.1.2. Anodically Formed Oxides.- 5.2. Deposited Dielectrics.- 6. Indium Arsenide.- 7. Gallium Phosphide.- 8. Gallium Arsenide Phosphide.- 9. Whither Surface States.- 10. Low-Temperature Deposition of Dielectric Layers.- 11. Conclusion.- References.- 5. III-V Inversion-Layer Transport.- 1. Introduction.- 2. Quantization.- 2.1. Surface Subbands.- 2.2. Approximate Solutions.- 2.3. Effects of Nonparabolicity.- 3. Surface Scattering Mechanisms.- 3.1. Coulomb Scattering.- 3.2. Surface Roughness Scattering.- 4. Phonon Scattering.- 4.1. The Acoustic Interaction.- 4.2. Scattering by Polar Modes.- 4.3. Remote Optical Phonons.- 4.4. High Fields.- 5. Experimental Results.- 5.1. Subband Structure.- 5.2. Transport Measurements.- Summary.- References.- 6. Interfacial Constraints on III-V Compounds MIS Devices.- 1. Introduction.- 2. Dielectric-Semiconductor Interfacial Phenomena.- 2.1. Trapping.- 2.2. Scattering.- 2.3. Recombination.- 3. MIS-Device Characteristics.- 3.1. Field-Effect Transistors.- 3.2. Charge-Coupled Devices.- 3.3. Integrated Circuits.- 3.4. Optical Devices.- 3.5. Memory Cells.- 4. Device Results.- 4.1. Gallium Arsenide.- 4.2. Indium Phosphide.- 4.3. Other Binary Compounds.- 4.4. Ternary and Quaternary Alloys.- 5. Epilogue.- References.- 7. Oxide/III-V Compound Semiconductor Interfaces.- 1. Introduction.- 1.1. Initial Oxidation.- 1.2. Thermodynamics.- 1.3. Vapor Pressure.- 2. The Chemically Cleaned Surface.- 2.1. Polishing and Exposure to Air.- 2.2. Chemical Etching and Growth of a Chemical Oxide.- 3. Thermal Oxides.- 3.1. General Overview.- 3.2. InP.- 3.3. GaP.- 3.4. GaAs, GaSb, and InSb.- 3.5. InAs.- 3.6. In0.53Ga0.47As.- 4. Anodic Oxides.- 4.1. Anodic Oxidation Process.- 4.2. Anodization Parameters.- 4.2.1. The Electrolyte.- 4.2.2. Viscosity.- 4.2.3. Current Density.- 4.2.4. pH.- 4.3. Initial Growth.- 4.4. Chemical Composition of Anodic Oxides and Interfaces.- 4.4.1. GaAs.- 4.4.2. InP.- 4.4.3. GaP.- 4.4.4. InAs.- 4.4.5. GaSb.- 4.4.6. InSb.- 4.5. Thermal Annealing of the Anodic Oxides.- 5. Plasma-Grown Oxide.- References.
| Zusatzinfo | biography |
|---|---|
| Verlagsort | Dordrecht |
| Sprache | englisch |
| Gewicht | 818 g |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| ISBN-10 | 0-306-41769-3 / 0306417693 |
| ISBN-13 | 978-0-306-41769-6 / 9780306417696 |
| Zustand | Neuware |
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