Modern Electroplating
John Wiley & Sons Inc (Verlag)
9780471168249 (ISBN)
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A new collection of authoritative contributions on the state of the art of electrochemical deposition Since the last edition of Modern Electroplating was published over a quarter century ago, electrochemical deposition has evolved into a mature science, with many new and potential applications. To address these developments, Modern Electroplating, Fourth Edition presents an entirely new collection of contributions on a wide range of cutting--edge topics, from electrodeposition of semiconductors to environmental considerations. Geared to experienced deposition practitioners and novices alike, the new edition provides clear, thorough, up--to--date explanations of the principles and applications of highly relevant deposition techniques. It not only replaces the Third Edition, a very useful resource on electroplating processes, but, in addition, highlights the transition in the electronics industry from physical to electrochemical methods, especially with regard to next--generation technologies such as copper interconnect.
Coverage includes: Electrodeposition of various metals and metal alloys Electrodeposition of semiconductors and electrodeposition on nonconductors Electrodeposition of conductive polymers Electroless deposition of various metals and alloys Preparation procedures for deposition Manufacturing technologies, monitoring, testing, and control Deposition and the environment
MORDECHAY SCHLESINGER, PhD, is a professor in the Department of Physics at the University of Windsor, Ontario, Canada. MILAN PAUNOVIC, PhD, is a researcher at IBM, T. J. Watson Research Center, Yorktown Heights, New York.
Fundamental Considerations. (M. Paunovic, et al.). Electrodeposition of Copper (J. Dini). Electrodeposition of Nickel (G. Di Bari). Electrodeposition of Gold (P. Kohl). Electroless and Electrodeposition of Silver (M. Schlesinger). Tin and Tin Alloys for Lead--Free Solder (Y. Zhang & J. Abys). Electrodeposition of Chromium (N. Mandich & D. Snyder). Electrodeposition of Lead and Lead Alloys (M. Jordan). Electrodeposition of Tin--Lead Alloys (M. Jordan). Electrodeposition of Zinc and Zinc Alloys (R. Winand). Electrodeposition of Iron and Iron Alloys (M. Izaki). Electrodeposition of Palladium and Palladium Alloys (J. Abys & C. Dullaghan). Nickel Alloys, Cobalt, and Cobalt Alloys (G. Di Bari). Electrodeposition of Semiconductors, (T. Schlesinger). Deposition on Nonconductors (M. Schlesinger). Electrodeposition of Organic Films: Conductive Polymers (T. Osaka, et al.). Electroless Deposition of Copper (M. Paunovic). Electroless Deposition of Nickel (M. Schlesinger). Electroless Deposition of Cobalt Alloy Films (T. Osaka, et al.). Electroless Deposition of Palladium and Platinum (I. Ohno). Electroless Deposition of Gold (Y. Okinaka & M. Kato). Electroless Deposition of Alloys (I. Ohno). Preparation for Deposition (D. Snyder). Manufacturing Technologies (D. Turner). Monitoring and Control (D. Turner). Environmental Aspects of Electrodeposition (M. Tomkiewicz). Appendix. Index.
| Erscheint lt. Verlag | 18.9.2000 |
|---|---|
| Reihe/Serie | Electrochemical Society S. |
| Überarbeitung | Mordechay Schlesinger, Milan Paunovic |
| Zusatzinfo | figures, illustrations |
| Verlagsort | New York |
| Sprache | englisch |
| Maße | 189 x 261 mm |
| Gewicht | 1559 g |
| Einbandart | gebunden |
| Themenwelt | Naturwissenschaften ► Chemie ► Physikalische Chemie |
| Technik ► Maschinenbau | |
| ISBN-13 | 9780471168249 / 9780471168249 |
| Zustand | Neuware |
| Informationen gemäß Produktsicherheitsverordnung (GPSR) | |
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