Wafer Bonding

Applications and Technology

Marin Alexe, Ulrich Gösele (Herausgeber)

Buch | Hardcover

XV, 504 Seiten

2004
Springer Berlin (Verlag)
978-3-540-21049-8 (ISBN)

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During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

1 Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding.- 2 Basics of Silicon-on-Insulator (SOI) Technology.- 3 Silicon-on-Insulator by the Smart CutTM Process.- 4 ELTRAN® Technology Based on Wafer Bonding and Porous Silicon.- 5 Wafer Bonding for High-Performance Logic Applications.- 6 Application of Bonded Wafers to the Fabrication of Electronic Devices.- 7 Compound Semiconductor Heterostructures by Smart CutTM: SiC On Insulator, QUASICTM Substrates, InP and GaAs Heterostructures on Silicon.- 8 Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach.- 9 Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers.- 10 High-Density Hybrid Integration of III–V Compound Optoelectronics with Silicon Integrated Circuits.- 11 Layer Transfer by Bonding and Laser Lift-Off.- 12 Single-Crystal Lithium Niobate Films by Crystal Ion Slicing.- 13 Wafer Bonding of Ferroelectric Materials.- 14 Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications.

Erscheint lt. Verlag	14.5.2004
Reihe/Serie	Springer Series in Materials Science
Zusatzinfo	XV, 504 p. 383 illus., 20 illus. in color.
Verlagsort	Berlin
Sprache	englisch
Maße	155 x 235 mm
Gewicht	845 g
Themenwelt	Naturwissenschaften ► Physik / Astronomie ► Atom- / Kern- / Molekularphysik
	Naturwissenschaften ► Physik / Astronomie ► Festkörperphysik
	Naturwissenschaften ► Physik / Astronomie ► Thermodynamik
Schlagworte	Basics • compound semiconductors • Crystal • Diode • Helium-Atom-Streuung • Integrated circuit • Leiterplatten • Logic • MEMS • optoelectronics • semiconductor • semiconductors • Silicon-on-insulator • Wafer • Wafer bonding
ISBN-10	3-540-21049-0 / 3540210490
ISBN-13	978-3-540-21049-8 / 9783540210498
Zustand	Neuware