Advanced Liquid Metal Cooling for Chip, Device and System
Springer Verlag, Singapore
9789811359217 (ISBN)
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Discussing major breakthrough features, unique scientific and practical merits, and intriguing liquid metal coolant or medium behaviors in connection with powerful next-generation cooling systems, the book appeal to a broad readership. Further, the combination of key fundamental and practical aspects offers inspiration for researchers looking for new ways of making advanced cooling systems to meet the increasingly pressing needs of today's highly integrated chip industry.
Dr. Jing Liu has been a Professor at the Technical Institute of Physics and Chemistry, Chinese Academy of Sciences (CAS) since 1999, and at Tsinghua University since 2008. He received double bachelor's degrees (B.E. in Power Engineering and Control and B.S. in Physics) in 1992, and a Ph.D. in Thermal Science in 1996, all from Tsinghua University, where he has also served as an Assistant Professor. In addition he was a postdoctoral research associate at Purdue University, and a senior visiting scholar at Massachusetts Institute of Technology. Dr. Liu's work focuses on the interdisciplinary areas between liquid metals, thermal science, biomedical engineering, and mobile healthcare technology. He has made significant contributions to the bioheat transfer field through numerous conceptual innovations, methodological developments and technical inventions, several of which have been translated into clinical use. Dr. Liu has pioneered a group of nonconventional technologies and fundamental scientific discoveries by introducing room-temperature liquid metals into a diverse range of areas, which has successfully opened a number of new directions in chip cooling, printed electronics and 3D printing, advanced energy, soft machines and biomedical engineering. As an educator, Dr. Liu has also made important contributions, especially through ten books, many of which have since been widely adopted as textbooks throughout China and overseas, and his book on Micro/Nano Scale Heat Transfer, first released in 2001, has been reprinted five times. In addition, Dr. Liu has published more than twenty invited book chapters and over five hundred peer-reviewed journal articles. Dr. Liu has received numerous major awards, including: The William Begell Medal, R&D 100 Awards Finalist; 2010-2011 Best Paper of the Year Award from ASME Journal of Electronic Packaging; the 2003 National Science Fund for Distinguished Young Scholars of China, National Science and Technology Award for Chinese Young Scientists; CCTV 2015 Top Ten Figures in Science and Technological Innovation; and the highest teaching award from the CAS (six times).
Introduction.- Typical Liquid Metal Medium and Properties.- Preparations and Characterizations of Liquid Metal Materials.- Corrosion Issues in Liquid Metal based Thermal Management.- Nano Liquid Metal towards Making Enhanced Materials.- Liquid Metal Based Thermal Interface Material.- Low Melting Point Metal Enabled Phase Change Cooling.- Fluidic Properties of Liquid Metal.- Convective Liquid Metal Cooling and Its Applications in Diverse Areas.- Self-Adaptable Liquid Metal Cooling.- Liquid Metal Cooling in Small Space.- Hybrid Cooling via Liquid Metal and Aqueous Solution.- Liquid Metal for the Harvesting of Heat and Energy.- Combinatorial Liquid Metal Heat Transfer towards Extreme Cooling.
| Erscheint lt. Verlag | 11.12.2019 |
|---|---|
| Zusatzinfo | 180 Illustrations, color; 120 Illustrations, black and white; Approx. 500 p. 300 illus., 180 illus. in color. |
| Verlagsort | Singapore |
| Sprache | englisch |
| Maße | 155 x 235 mm |
| Themenwelt | Naturwissenschaften ► Physik / Astronomie ► Thermodynamik |
| Technik ► Maschinenbau | |
| Schlagworte | Advanced Cooling • electronics cooling • Energy harvesting • Heat Transfer Enhancement • High Flux Chip • liquid metal • optoelectronic devices • Power System • thermal management |
| ISBN-13 | 9789811359217 / 9789811359217 |
| Zustand | Neuware |
| Informationen gemäß Produktsicherheitsverordnung (GPSR) | |
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