Simulation based analysis of LED package reliability regarding encapsulant related failures

Stefan Watzke (Autor)

Buch | Softcover

166 Seiten

2016
Fraunhofer Verlag
9783839609569 (ISBN)

Infos

Within the work several LED encapsulation material related reliability issues are investigated by means of finite element analysis (FEM). The typically used silicone and epoxy materials are mechanically characterized after subjecting them to different environmental conditions. Based on these investigations material models for the FEM are created. Finally, the material models are used to simulate some encapsulation related reliability issues.

Produkt-Details

• Erscheinungsdatum: 08.10.2016
• Zusatzinfo: zahlr., teils farb. Abb. u. Tab.
• Verlagsort: Stuttgart
• Sprache: deutsch
• Maße: 148 x 210 mm
• Themenwelt: Naturwissenschaften ► Physik / Astronomie ► Mechanik
• Themenwelt: Technik ► Elektrotechnik / Energietechnik
• Themenwelt: Technik ► Maschinenbau
• Schlagworte: dynamics & statics • Dynamik und Statik • finite element analysis • Fraunhofer IZM • LED • Materialcharakterisierung • Materialwissenschaftler • mechanics of solids • Mechanik von Festkörpern • Modellierung und Simulation • Testing of materials
• ISBN-13: 9783839609569 / 9783839609569
• Zustand: Neuware