Adhesion in Microelectronics (eBook)

K. L. Mittal, Tanweer Ahsan (Autoren)

eBook Download: PDF

2014
John Wiley & Sons (Verlag)
978-1-118-83135-9 (ISBN)

Infos

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings

Autor

Kashmiri Lal Mittal was employed by the IBM Corporation from 1972 through 1993. Currently, he is teaching and consulting worldwide in the broad areas of adhesion as well as surface cleaning. He has received numerous awards and honors including the title of doctor honoris causa from Maria Curie-Sk?odowska University, Lublin, Poland. He is the editor of more than 110 volumes dealing with adhesion measurement, adhesion of polymeric coatings, polymer surfaces, adhesive joints, adhesion promoters, thin films, polyimides, surface modification, surface cleaning, and surfactants. Dr. Mittal is also the Founding Editor of the journal Reviews of Adhesion and Adhesives. Tanweer Ahsan is a scientist engineer at Henkel Electronic Materials LLC in Irvine, California.

Produkt-Details

• Erscheint lt. Verlag: 15.8.2014
• Reihe/Serie: Adhesion and Adhesives - Fundamental and Applied Aspects
• Reihe/Serie: Adhesion and Adhesives - Fundamental and Applied Aspects
• Reihe/Serie: Adhesion and Adhesives: Fundamental and Applied Aspects
• Sprache: englisch
• Themenwelt: Naturwissenschaften ► Chemie ► Technische Chemie
• Themenwelt: Technik ► Elektrotechnik / Energietechnik
• Themenwelt: Technik ► Maschinenbau
• Schlagworte: Adhäsion • Adhäsion • Adhesion • application • Chemie • Chemistry • Electrical & Electronics Engineering • electron • Elektrotechnik u. Elektronik • IETS • Inelastic • Joining, Welding and Adhesion • Kumar • Materials Science • Materialwissenschaften • MEMS • Metalle u. Legierungen / Verbinden, Schweißen u. Kleben • Metalle u. Legierungen / Verbinden, Schweißen u. Kleben • microelectronics • microelectronics robert • Mikroelektronik • molecular • Oberflächen- u. Kolloidchemie • Oberflächen- u. Kolloidchemie • Part • Reference • References • Relevance • Special • spectroscopy • Study • Surface & Colloid Chemistry • thin • weisheng lei • XVI
• ISBN-10: 1-118-83135-7 / 1118831357
• ISBN-13: 978-1-118-83135-9 / 9781118831359