VLSI-SoC: Technology Advancement on SoC Design
Springer International Publishing (Verlag)
978-3-032-09574-9 (ISBN)
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This book IFIP 744 contains revised versions of the best papers presented at the 32nd IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip, VLSI-SoC 2024, held in Tangier, Morocco, during October 6-9, 2024.
The 8 full papers were carefully reviewed and selected from 65 submissions. They were categorized under the topical sections as follows:
Efficiency and Performance
Memory and Data Management
Reliability and Trustworthiness
Efficiency and Performance.- A Wide-Range Low-Power Phase Interpolation-Based Delay Line with a Linearity Improvement Technique.- Quantum Carry-Save Modular Addition with Optimized Depth and Resource Utilization.- Efficient DNN Training Using Vectorized Block-Scaled GeMMs with Adaptive Block Shapes.- Memory and Data Management.-Application-Aware Memory Management for IPsec on Heterogeneous SoCs.- Scalable Design Techniques for Expanding Ferroelectric-Based Non-Volatile SRAMs Applications.- Reliability and Trustworthiness.- Verification and Debugging of Modular (2n 1) Multipliers Using Linear Algebra Technique.- Challenges in FPGA Resource Allocation and Placement for Efficient EM Fault Attack Detection Strategies.- An Open-Source Containerized Toolchain for Behavioral FSM Logic Locking.
| Erscheinungsdatum | 29.11.2025 |
|---|---|
| Reihe/Serie | IFIP Advances in Information and Communication Technology |
| Zusatzinfo | VII, 148 p. 96 illus., 46 illus. in color. |
| Verlagsort | Cham |
| Sprache | englisch |
| Maße | 155 x 235 mm |
| Themenwelt | Mathematik / Informatik ► Informatik ► Software Entwicklung |
| Informatik ► Weitere Themen ► Hardware | |
| Schlagworte | Analog and mixed-signal circuit design and optimization • Hardware Reliability • Hardware Test • Hardware Trust • reconfigurable logic and fpgas • Semiconductour memory • VLSI Design Rules • VLSI system specification and constraints |
| ISBN-10 | 3-032-09574-3 / 3032095743 |
| ISBN-13 | 978-3-032-09574-9 / 9783032095749 |
| Zustand | Neuware |
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