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3rd International Congress of Electrical and Computer Engineering -

3rd International Congress of Electrical and Computer Engineering

ICECENG 2024

Muhammet Nuri Seyman (Herausgeber)

Buch | Hardcover
XXIII, 508 Seiten
2025
Springer International Publishing (Verlag)
978-3-031-88998-1 (ISBN)
CHF 329,50 inkl. MwSt
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This proceedings presents the papers included in the 3rd International Congress of Electrical and Computer Engineering (ICECENG), which took place in Bandirma, Turkey, 27-30 November 2024. The conference aims to bring together researchers, developers, and students in computing, technology trends, artificial intelligence, and security who are interested in studying the application of formal methods to the construction and analysis of models describing technological processes at both micro and macro levels. ICECENG 24 also aims to provide a platform for discussing the issues, challenges, opportunities, and findings of computer engineering research. The conference seeks to provide some answers and explore the processes, actions, challenges, and outcomes of learning and teaching.

Muhammet Nuri Seyman works as aprofessor at Electrical and Electronics Engineering Department at the Bandirma Onyedi Eylul University of Turkey. His current research interests include multicarrier techniques such as OFDM, MC-CDMA, NOMA and MIMO systems and applications of artificial intelligence approaches for communications problems.

Introduction.- Computing.- Quantum Computing.- Cognitive Computing.- High Performance Computing.- Distributed and parallel systems.- Social Computing.- Cloud Computing.- Grid Computing.- Human-centered Computing.- Mobile Computing.- Complex Systems.- Communication.- Networking.- Wireless/ Mobile Communication.- Satellite Communication Systems.- 3G/4G/5G Network Evolution.- Connected Machines.- Mobile Adhoc Networks.- Open Spectrum Solutions.- Communication Protocols.- Cognitive Radio.- Mobile Apps.- Signal Processing.- Conclusion.

Erscheinungsdatum
Reihe/Serie EAI/Springer Innovations in Communication and Computing
Zusatzinfo XXIII, 508 p. 184 illus., 157 illus. in color.
Verlagsort Cham
Sprache englisch
Maße 155 x 235 mm
Themenwelt Informatik Theorie / Studium Künstliche Intelligenz / Robotik
Informatik Weitere Themen Hardware
Technik Elektrotechnik / Energietechnik
Technik Nachrichtentechnik
Schlagworte Applications • Computer Science • conference proceedings • Informatics • Research
ISBN-10 3-031-88998-3 / 3031889983
ISBN-13 978-3-031-88998-1 / 9783031889981
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