Advanced Wirebond Interconnection Technology (eBook)

Shankara K. Prasad (Autor)

eBook Download: PDF

2006
Springer US (Verlag)
978-1-4020-7763-0 (ISBN)

Infos

Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.

Produkt-Details

• Erscheint lt. Verlag: 10.5.2006
• Sprache: englisch
• Themenwelt: Mathematik / Informatik ► Informatik ► Netzwerke
• Themenwelt: Technik ► Maschinenbau
• ISBN-10: 1-4020-7763-7 / 1402077637
• ISBN-13: 978-1-4020-7763-0 / 9781402077630