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More than Moore Technologies for Next Generation Computer Design

Rasit O. Topaloglu (Herausgeber)

Buch | Hardcover

218 Seiten

2015
Springer-Verlag New York Inc.
978-1-4939-2162-1 (ISBN)

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This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore's Law”. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.

Rasit O. Topaloglu is an Advisory R&D Engineer at IBM.

Impact of TSV and Device Scaling on the Quality of 3D Ics.- 3D Integration Technology.- Design and Optimization of Spin-Transfer Torque MRAMs.- Embedded STT-MRAM: Device and Design.- A Thermal and Process Variation Aware MTJ Switching Model and Its Applications in Soft Error Analysis.- Nano-Photonic Networks-on-Chip for Future Chip Multiprocessors.- Design Automation for On-chip Nanophotonic Integration.

Zusatzinfo	63 Illustrations, color; 53 Illustrations, black and white; IX, 218 p. 116 illus., 63 illus. in color.
Verlagsort	New York
Sprache	englisch
Maße	155 x 235 mm
Themenwelt	Mathematik / Informatik ► Informatik ► Theorie / Studium
Themenwelt	Technik ► Elektrotechnik / Energietechnik
Schlagworte	3D Integrated Circuits • Emerging Memory for Integrated Circuits • Low Power Integrated Circuits • More than Moore • Optical Interconnect • Photonic Interconnect • Scalable Heterogeneous Memory • STT-MRAM
ISBN-10	1-4939-2162-2 / 1493921622
ISBN-13	978-1-4939-2162-1 / 9781493921621
Zustand	Neuware