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Arbitrary Modeling of TSVs for 3D Integrated Circuits

Khaled Salah, Yehea Ismail, Alaa El-Rouby (Autoren)

Buch | Hardcover

IX, 179 Seiten

2014
Springer International Publishing (Verlag)
9783319076102 (ISBN)

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This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

Introduction: Work around Moore's Law.- 3D/TSV Enabling Technologies.- TSV Modeling and Analysis.- TSV Verification.- TSV Macro-Modeling Framework.- TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter.- Imperfection in TSV Modeling.- New Trends in TSV.- TSV Fabrication.- Conclusions.

Erscheint lt. Verlag	5.9.2014
Reihe/Serie	Analog Circuits and Signal Processing
Zusatzinfo	IX, 179 p. 159 illus., 99 illus. in color.
Verlagsort	Cham
Sprache	englisch
Maße	155 x 235 mm
Gewicht	455 g
Themenwelt	Mathematik / Informatik ► Informatik ► Theorie / Studium
Themenwelt	Technik ► Elektrotechnik / Energietechnik
Schlagworte	3D/TSV Integration Technology • Three Dimensional Integrated Circuits • Through Silicon Via • TSV • TSV Design Applications • TSV Modeling and Analysis
ISBN-13	9783319076102 / 9783319076102
Zustand	Neuware