Modeling and Simulation of High Speed VLSI Interconnects

A Special Issue of Analog Integrated Circuits and Signal Processing An International Journal Vol. 5, No. 1 (1994)

Michel S. Nakhla, Q.J. Zhang (Herausgeber)

Buch | Softcover

108 Seiten

2012 | Softcover reprint of the original 1st ed. 1994
Springer-Verlag New York Inc.
9781461361718 (ISBN)

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Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area.
Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.

Guest Editors’ Introduction.- Efficient Transient Analysis of Nonlinearly Loaded Low-Loss Multiconductor Interconnects.- A Simplified Synthesis of Transmission Lines with a Tree Structure.- An Interconnect Model for Arbitrary Terminations Based on Scattering Parameters.- Electromagnetic Analysis of Multiconductor Losses and Disperion in High-Speed Interconnects.- Circuit Modeling of General Hybrid Uniform Waveguide Structures in Chiral Anisotropic Inhomogeneous Media.- An Efficient, CAD-Oriented Model for the Characteristic Parameters of Multiconductor Buses in High-Speed Digital GaAs ICs.- Full-Wave Analysis of Radiation Effect of Microstrip Transmission Lines.- Optimizing VLSI Interconnect Model for SPICE Simulation.- Statistical Simulation and Optimization of High-Speed VLSI Interconnects.

Zusatzinfo	108 p.
Verlagsort	New York, NY
Sprache	englisch
Maße	195 x 260 mm
Themenwelt	Mathematik / Informatik ► Informatik ► Theorie / Studium
Themenwelt	Technik ► Elektrotechnik / Energietechnik
ISBN-13	9781461361718 / 9781461361718
Zustand	Neuware