More than Moore (eBook)

Creating High Value Micro/Nanoelectronics Systems

Alfred van Roosmalen, Guo Qi Zhang (Herausgeber)

eBook Download: PDF

2010 | 2009
XI, 332 Seiten
Springer US (Verlag)
978-0-387-75593-9 (ISBN)

Infos

In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for 'More than Moore' (MtM) products and technology that are based upon or derived from silicon technologies, but do not simply scale with Moore's law. This book provides new vision, strategy and guidance for the future technology and business development of micro/nanoelectronics.

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In the past decades, the main stream of microelectronics progress has been mainly powered by Moore's law which focuses on IC miniaturization down to nanoscale. While the microelectronics community around the world continues to invent new solutions to keep Moore's law alive, there is a fast increasing need for non-digital and mixed-signal "e;More than Moore"e; (MtM) type  technologies that are still based upon or derived from silicon technologies, but do not simply scale with Moore's law. Typical examples are devices incorporating RF, power/high voltage, passive components, sensors and actuators, MEMS, Bio-chip/bio-systems, microfluidics, solid-state lighting, etc.. The increasing momentum of MtM is triggered by the increasing needs for high level heterogeneous system integration including non-digital functions, the necessity to speed up innovative product creation and to broaden the product portfolio of IC fabs, and the limiting cost and time factors of advanced system-on-chip (SoC) development. It is believed that MtM will add value to society on top of and beyond advanced semiconductors technologies, with fast increasing marketing potentials, and that it will drive paradigm shift for technologies, applications and business models.

Inhalt

Preface 5
Contents 6
Contributors 8
Chapter 1 11
The Changing Landscape of Micro/Nanoelectronics 11
1.1 Introduction 11
1.2 Technology Evolution 13
1.2.1 More Moore (MM) 13
1.2.2 More than Moore (MtM) 16
1.2.3 Beyond CMOS 21
New State Variables 22
Information Transfer 22
Heat Transfer Management 23
1.2.4 Systems Architecture and Design 26
Design for Heterogeneous System 26
Design for Manufacturability 27
Design for Reliability 27
Design for Testability 28
1.2.5 Software 28
1.2.6 Heterogeneous Integration and Packaging 30
1.3 Business Development Trends 33
Economic Scale 33
Cost for Operation 33
Devirtualization 34
Specialization 34
Advanced CMOS Manufacturing Has Become a Commodity 35
System Knowledge 36
Function Integration 36
Fablite and Fabless 37
Ecosystems 37
1.4 Making it Happen 37
1.5 Conclusions 39
References 40
Chapter 2 42
Smart Integrated Systems: From Components to Products 42
2.1 Introduction 43
2.2 State of Technology 44
2.2.1 Automotive 44
2.2.2 Aeronautics 46
2.2.3 Information and Telecommunication 46
2.2.4 Medical Technologies 47
2.2.5 RFID 49
2.3 Future Trends and Application Examples 51
2.3.1 Automotive 51
2.3.1.2 Future Trends 53
2.3.2 Aeronautics 54
2.3.2.2 Future Trends 56
2.3.3 Information and Telecommunication 58
2.3.3.2 Future Trends 59
2.3.4 Medical Technologies 60
2.3.4.1 Application Example: Integration Aspects of a Polymer-Based SPR Biosensor with Active Micro-optical and Micro-fluidic 61
2.3.4.2 Future Trends 62
2.3.5 RFID 64
2.3.5.1 Application Example: Smart Active ID Label for Transport Monitoringby D. Reuter and A. Bertz, Chemnitz University of 65
2.3.5.2 Future Trends 66
2.4 Cross-Cutting Issues 66
2.5 Conclusions 70
References 71
Chapter 3 72
RF Technologies and Systems 72
3.1 Introduction 72
3.2 Multilayer Thin-Film Technologies 74
3.2.1 Thin-Film Technology for Integrated Passives Devices 74
3.2.2 “Above-IC” RF-SOC 77
3.3 RF-MEMS Technology 78
3.3.1 RF-MEMS Switches 79
3.3.2 FBAR Resonators 80
3.3.3 RF-MEMS Packaging and Reliability 81
3.4 Using the Third Dimension 82
3.4.1 Why Moving Toward the Third Dimension 83
3.4.2 3D Systems in a Package for Highly Miniaturized Systems 83
3.4.3 Packaging Technologies up to Millimeter-Wave Integration 85
3.5 Further Trends 85
3.5.1 Wafer Reconstitution Techniques 86
3.5.2 3D Integration Using Ultra-Thin Chip Stacking 87
3.6 Concluding Remarks 90
References 91
Chapter 4 94
High Voltage and Power 94
4.1 Introduction 94
4.2 SSL Technology 96
4.2.1 General Lighting Technology 96
4.2.2 New Technology 96
4.2.3 Fluorescent Lamps and Driving Methodology 98
4.2.4 IC for the Fluorescent Lamps 101
4.2.5 LED Lighting 103
4.2.6 IC for LED Driving 104
4.3 Automotive IC Technology 107
4.3.1 Introduction and General Automotive Survey 107
4.3.2 Engine Evolution: Major Trends 109
4.3.2.1 Gasoline Engine 109
4.3.2.2 Diesel Engine 109
4.3.2.3 Hybrid Cars 110
4.3.2.4 Engine Auxiliaries 110
4.3.3 High-Voltage and High-Power Silicon Technology 111
4.4 Research Subjects 114
4.5 Energy and Efficiency [3] 114
4.5.1 Energy Generation 114
4.5.2 Energy Efficiency 115
4.5.3 Power for Mobile Communication 116
References 116
Chapter 5 117
Sensors and Actuators on CMOS Platforms 117
5.1 Introduction 117
5.2 Sensing Fundamentals 119
5.2.1 Piezoelectric Sensing 122
5.2.2 Piezoresistive Sensing 123
5.2.3 Capacitive Sensing 124
5.2.4 Thermal Sensing 127
5.3 Actuation Fundamentals 130
5.3.1 Electrostatic Actuators 131
5.3.1.1 Parallel Plate Actuator 131
5.3.1.2 Linear Surface Drive 132
5.3.1.3 Comb Drive 133
5.3.2 Piezoelectric Actuators 134
5.3.3 Thermal Actuators 134
5.3.4 Electromagnetic Actuators 136
5.4 S& A Applications and Products
5.4.1 Micromachined Sensors in the Automotive Market 140
5.4.2 Microfabricated Actuators in the Consumer Market 141
5.4.3 “The MEMS Consumerization Wave” 143
5.4.3.1 Hard-Disk Drive Free-Fall Protection 143
5.4.3.2 Mobile Phones and Portable Multimedia Players 144
5.4.3.3 Microfabricated Accelerometers in Game Consoles 144
5.4.3.4 Sensors for Optical Image Stabilization 145
5.4.3.5 Pedestrian Navigation for Location-Based Services 145
5.4.4 The S& A Market: Quo Vadis?
5.5 CMOS Technology for S& As
5.5.1 Materials and Processes 149
5.5.1.1 Specific Materials Used in S& A Applications
5.5.1.2 Specific MEMS Processes for S& A Applications
5.5.2 Monolithic CMOS/S& A Technology
5.5.2.1 Pure CMOS S& A Technology
5.5.2.2 Pre-CMOS S& A Technology
5.5.2.3 Intermediate-CMOS S& A Technology
5.5.2.4 Post-CMOS S& A Technology
5.5.3 Hybrid CMOS/S& A Integration Technology
5.5.3.1 Wafer-Level Stacking Technology 160
5.5.3.2 Wafer-Level Device-Transfer Technology 161
5.5.3.3 Die-To-Die/Wafer Flip-Chip Integration 163
5.5.4 Design Tools 164
5.6 Packaging, Assembly, and Testing of S& As for Large-Volume Production
5.6.1 Packaging: History, Current Technologies, and Trends 166
5.6.2 Packaging of the LIS3L02AL Micromachined Accelerometer: A Case Study 169
5.6.3 Production Testing 172
5.6.4 Next-Generation Challenges 173
5.7 Nanostructures for S& As
5.8 Outlook and Summary 176
References 177
Chapter 6 186
Biochips 186
6.1 Introduction 186
6.2 General Architecture of Microsystem for Biology and Chemistry 188
6.3 Microfluidics 189
6.3.1 Continuous Flow and Monophasic Microfluidics 190
6.3.2 Digital Microfluidics 192
6.3.3 Diphasic Microfluidics in Microchannels 193
6.4 Embedded Functions 194
6.4.1 Sample Preparation 194
6.4.2 Mechanical Filtering 194
6.4.3 Active Filter 195
6.4.4 Example of Microfluidic System for Extracting Nucleic Acids for DNA and RNA Analysis 197
6.4.5 Liquid-Liquid Extraction 197
6.4.6 Separation on Solid Phase 199
6.4.7 Magnetic Particles 200
6.4.8 Polymerase Chain Reaction 201
6.4.9 Transduction 203
6.4.10 Technological Aspect 205
6.5 Conclusion 206
References 206
Chapter 7 210
Optoelectronics 210
7.1 Introduction 210
7.2 Optoelectronics Devices 212
7.2.1 III–V semiconductor Materials for Optoelectronic Devices 212
7.2.2 Quantum Confined Effect in Low-Dimensional Semiconductor Structures 214
7.2.3 LEDs and OLEDs Basic Concept 216
7.2.4 OLEDs Technology 218
7.2.5 Research and Development of LEDs on Graded Buffer 220
7.2.5.1 LED Simulation 220
7.2.5.2 Growth and Characterization the LED Structure 222
7.2.6 LEDs and OLEDs Recent Development and Trends 227
7.2.7 Photodetectors for Optical Communications 229
7.2.7.1 Photodetectors Basic Concept 229
7.2.8 RCE Photodetectors 231
7.2.8.1 Design of RCE Photodetectors 231
7.2.8.2 Semiconductor Bragg Reflectors for 855 and 1300 nm Wavelength Ranges 231
7.2.8.3 Tunable MQW RCE Photodetector Design and Characterization 234
7.2.9 Design and Characterization of Separated Absorption, Charge, and Multiplication (SACM) InGaAs/InGaAsP/InP APD Structure 236
7.2.10 Recent Developments in Optical Communications 238
7.3 Silicon Photonics 239
7.3.1 Silicon-Photonic Circuits 240
7.3.2 Planar Silicon Waveguides 241
7.3.3 Moore’s Law for Photonics and Beyond 242
References 243
Chapter 8 246
Semiconductor Image Sensing 246
8.1 Introduction 247
8.2 Fundamentals of Semiconductor Image Sensing 248
8.2.1 Interaction of Light and Semiconductor 248
8.2.2 Quantum Efficiency 248
8.2.3 Temperature Effects: Dark Current 250
8.2.4 Photosensor Principles: Photodiode and CCD 251
8.3 Semiconductor Technology for Imaging 252
8.3.1 Silicon Sensors 252
8.4 Examples and Applications of Imagers 256
8.4.1 Electronic Imaging in the Visible Spectrum 256
8.4.1.1 Challenges and Opportunities 257
8.4.1.2 Single-Chip Digital Low-Power Camera 259
8.4.1.3 High-Sensitivity Electronic Imaging, Single-Chip Digital Low-Power Camera 260
8.4.1.4 Color Imaging 265
8.4.1.5 High-Speed Image Sensing 266
8.4.1.6 Optical Time-of-Flight 3D Cameras 268
8.4.2 Beyond the Visible Spectrum 269
8.4.2.1 Challenges and Opportunities 270
8.4.2.2 X-ray Imaging 270
Current Digital X-ray Image Sensors 271
New Image Sensor Concepts 271
8.4.2.3 Infrared Image Sensors 272
Infrared Detector Development 273
Focus on Microbolometer Technology 275
Focus on MCT 277
8.4.2.4 Terahertz Image Sensing: New Concepts 279
8.5 Outlook: The Future of Semiconductor Image Sensing 281
References 282
Chapter 9 286
Heterogeneous Integration: Building the Foundation for Innovative Products 286
9.1 Introduction 287
9.2 Physical Package Characterization, Lifetime Modeling, and Design for Reliability for Heterogeneous System Integration 290
9.3 Wafer-Level Integration 290
9.3.1 Integrated Passives 291
9.3.2 Extension of Redistribution Layers: Thin-Chip Integration 294
9.3.3 Functional Layer Technology 296
9.4 Module Integration Technologies 297
9.4.1 Embedding of Passive Components 298
9.4.2 Chip-in-Polymer 299
9.4.3 Chip Embedding into Flexible Substrates 300
9.4.4 Functional Packaging 301
9.4.5 Integration of Biological Functionalities 302
9.5 3D Integration 303
9.5.1 Package Stacking 303
9.5.2 Embedding of Active and/or Passive Devices 306
9.5.3 Stacking Without Through-Silicon Vias 306
9.5.4 Stacking with Through-Silicon Vias 307
9.6 Conclusion 309
References 310
Chapter 10 311
System-Level Design 311
10.1 Introduction 311
10.2 Background 312
10.2.1 Diversity 313
10.2.2 System Design Goals 314
10.2.2.1 Application Example 314
10.2.3 The Design Flow 315
10.2.3.1 The Hell of Nanophysics 315
10.2.3.2 More than Moore 316
10.2.4 The State-of-the-Art Technology 316
10.2.4.1 Current Trends in Microelectronics 318
10.2.4.2 Digital Design 318
Design and Implementation 319
Functional Verification 319
Conclusion 320
10.2.4.3 Analogue Design 321
10.2.4.4 System Design 322
10.2.4.5 Productivity Gap 323
10.2.5 Research Subjects/Future Trends 324
10.2.5.1 Analogue Circuits in Deep-Submicron and Nanometer CMOS 325
10.2.5.2 Layout and Modelling 326
10.2.5.3 Digital Design in Deep-Submicron CMOS 327
10.2.5.4 Executable Specifications 327
10.2.5.5 System Simulation 328
10.2.5.6 Finite Element Method 329
10.2.5.7 Thermal Simulators 329
10.2.5.8 Mechanical Simulators 331
10.2.5.9 Domain Decomposition 331
10.2.5.10 Time Domain Simulations 331
10.2.5.11 Error Propagation, Sensitivity Analysis 331
10.2.5.12 Temperature Analysis of Strongly Coupled Problems 332
10.2.5.13 Modelling 332
10.2.5.14 Methodology 332
10.2.5.15 Interaction Across Boundaries 333
10.2.5.16 Design Targets 334
10.2.5.17 Interaction with Equipment 335
10.2.6 Conclusions 335
Underlying Literature 336
Index 337

Produkt-Details

• Erscheint lt. Verlag: 23.1.2010
• Zusatzinfo: XI, 332 p.
• Verlagsort: New York
• Sprache: englisch
• Themenwelt: Mathematik / Informatik ► Informatik
• Themenwelt: Technik ► Elektrotechnik / Energietechnik
• Schlagworte: CMOS • Development • Electronics • heterogeneous system integration • IC fabs • IC miniaturization • Integrated circuit • microelectromechanical system (MEMS) • microelectronics • microfluidics • Moore's law • nanoscale • optoelectronics • semiconductor • Sensor • silicon technologies • SoC • solid-state lighting • System on chip (SoC) • System-on-Chip (SoC)
• ISBN-10: 0-387-75593-4 / 0387755934
• ISBN-13: 978-0-387-75593-9 / 9780387755939