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3D Integration for NoC-based SoC Architectures

Abbas Sheibanyrad, Frédéric Pétrot, Axel Jantsch (Herausgeber)

Buch | Hardcover

278 Seiten

2010
Springer-Verlag New York Inc.
978-1-4419-7617-8 (ISBN)

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This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.

Three-Dimensional Integration of Integrated Circuits - an Introduction.- The Promises and Limitation of 3-D Integration.- Testing 3D Stacked ICs Containing Through-Silicon Vias.- Design and Computer Aided Design of 3DIC.- Physical Analysis of NoC Topologies for 3-D Integrated Systems.- Three-Dimensional Networks-on-Chip: Performance Evaluation.- Asynchronous 3D-NoCs.- Design of Application-Specific 3D Networks-on-Chip Architectures.- 3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stacks.- 3-D NoC on Inductive Wireless Interconnect.- Influence of Stacked 3D Memory/Cache architectures on GPUs.

Erscheint lt. Verlag	10.12.2010
Reihe/Serie	Series on Integrated Circuits and Systems
Zusatzinfo	X, 278 p.
Verlagsort	New York, NY
Sprache	englisch
Maße	152 x 229 mm
Themenwelt	Mathematik / Informatik ► Informatik ► Software Entwicklung
Themenwelt	Technik ► Elektrotechnik / Energietechnik
ISBN-10	1-4419-7617-5 / 1441976175
ISBN-13	978-1-4419-7617-8 / 9781441976178
Zustand	Neuware