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Elektrotechnik / Energietechnik

ENCYCLO PACK MATER, PROCESS (4V)
Set 1: Interconnect and Wafer Bonding Technology(In 4 Volumes)Volume 1: Flip-Chip and Underfill Materials and TechnologyVolume 2: Wire Bonding..
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2019 | World Scientific Publishing..
ISBN: 9789811209642
989,72 €
(CHF 959,95) (inkl. MwSt)
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Using Language Technologies to Score Spontaneous Speech
von Keelan Evanini; Klaus Zechner
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2019 | Taylor and Francis
ISBN: 9781351676106
61,31 €
(CHF 59,90) (inkl. MwSt)
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Carbon Capture and Storage
von Mai Bui; Niall Mac Dowell
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2019 | Auflage: 1 | Royal Society of Chemistry
ISBN: 9781839160523
229,99 €
(CHF 224,70) (inkl. MwSt)
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Sustainable Design Solutions for Healthier Work and Living Environments
von Stevie Famulari
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2019 | Taylor and Francis
ISBN: 9781000699258
54,01 €
(CHF 52,75) (inkl. MwSt)
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Case Studies
von Chang-Tang Chang; Piyal Mondal; Mihir Kumar Purkait
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2019 | CRC Press
ISBN: 9780429686818
228,58 €
(CHF 219,95) (inkl. MwSt)
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Opportunities and Challenges for Achieving Sustainable Development Goals
von Ulisses Manuel de Miranda Azeiteiro; J. Paulo Davim
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2019 | CRC Press
ISBN: 9781351368360
60,10 €
(CHF 58,70) (inkl. MwSt)
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Aerodynamics of Wind Turbines
A Physical Basis for Analysis and Design
von Sven Schmitz
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2019 | Auflage: 1 | John Wiley & Sons
ISBN: 9781119405597
72,99 €
(CHF 69,95) (inkl. MwSt)
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