Force Sensors for Microelectronic Packaging Applications (eBook)

Jürg Schwizer, Michael Mayer, Oliver Brand (Autoren)

eBook Download: PDF

2005 | 2005
VIII, 178 Seiten
Springer Berlin (Verlag)
978-3-540-26945-8 (ISBN)

Infos

Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

Inhalt

Preface 6
Contents 8
1 Introduction 10
1.1 Electrical Interconnection Methods 10
1.2 The Wire Bonding Process 12
1.3 Measurement Approaches for Bonding Process Investigation 19
2 Sensor Design 21
2.1 Design Concept 21
2.2 Ball Bond Sensor 44
2.3 Wedge Bond Sensor 54
3 Measurement System 57
3.1 Test Chip 57
3.2 Wire Bonding Signals and Measurement System 61
4 Characterization 75
4.1 General Data 76
4.2 Sensor Calibration 76
4.3 Linearity 87
4.4 Placement Sensitivity 88
4.5 Offset 90
4.6 Summary of Technical Data of the Test Chip 100
5 Applications 101
5.1 Wire Bonder Development 102
5.2 Ball Bond Process Knowledge 123
5.3 Wedge Bonding Process Knowledge 147
5.4 Flip-Chip Application 162
6 Conclusions and Outlook 166
Conclusions 166
Outlook 167
Abbreviations, Symbols, and Definitions 168
Abbreviations 168
Symbols 169
Definitions 170
References 171
Subject Index 181

Produkt-Details

• Erscheint lt. Verlag: 11.12.2005
• Reihe/Serie: Microtechnology and MEMS
• Zusatzinfo: VIII, 178 p.
• Verlagsort: Berlin
• Sprache: englisch
• Themenwelt: Naturwissenschaften ► Chemie
• Themenwelt: Technik ► Elektrotechnik / Energietechnik
• Themenwelt: Technik ► Maschinenbau
• Themenwelt: Wirtschaft ► Betriebswirtschaft / Management
• Schlagworte: Design • Development • Flip-Chip • Force sensor • Interconnect • Piezoresistivity • process monitoring • Quality Control, Reliability, Safety and Risk • Reliability • semiconductor • Sensor • Technologie • Technology • Wire bonding
• ISBN-10: 3-540-26945-2 / 3540269452
• ISBN-13: 978-3-540-26945-8 / 9783540269458