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CCD Image Sensors in Deep-Ultraviolet - Flora Li, Arokia Nathan

CCD Image Sensors in Deep-Ultraviolet

Degradation Behavior and Damage Mechanisms

, (Autoren)

Buch | Hardcover
XII, 232 Seiten
2005 | 2005
Springer Berlin (Verlag)
978-3-540-22680-2 (ISBN)
CHF 224,65 inkl. MwSt
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As the deep-ultraviolet (DUV) laser technology continues to mature, an increasing number of industrial and manufacturing applications are emerging. For example, the new generation of semiconductor inspection systems is being pushed to image at increasingly shorter DUV wavelengths to facilitate inspection of deep sub-micron features in integrated circuits. DUV-sensitive charge-coupled device (CCD) cameras are in demand for these applications. Although CCD cameras that are responsive at DUV wavelengths are now available, their long-term stability is still a major concern. This book describes the degradation mechanisms and long-term performance of CCDs in the DUV, along with new results of device performance at these wavelengths.

Flora Li received her Bachelor of Applied Science degree in Electrical Engineering from University of Waterloo, Canada, in 2002. She completed her MASc degree in Electrical Engineering at University of Waterloo in 2003, where her research focus was on the investigation of deep-UV sensitive CCD image sensors and the related radiation damage issues. She is currently pursuing her Ph.D. degree in the field of organic electronics and polymer TFTs, under the supervision of Prof. Arokia Nathan at the University of Waterloo.

Overview of CCD.- CCD Imaging in the Ultraviolet (UV) Regime.- Silicon.- Silicon Dioxide.- Si-SiO2 Interface.- General Effects of Radiation.- Effects of Radiation on CCDs.- UV-Induced Effects in Si.- UV Laser Induced Effects in SiO2.- UV Laser Induced Effects at the Si-SiO2 Interface.- CCD Measurements at 157nm.- Design Optimizations for Future Research.- Concluding Remarks.

Erscheint lt. Verlag 1.3.2005
Reihe/Serie Microtechnology and MEMS
Zusatzinfo XII, 232 p. 84 illus.
Verlagsort Berlin
Sprache englisch
Maße 155 x 235 mm
Gewicht 525 g
Themenwelt Technik Elektrotechnik / Energietechnik
Technik Maschinenbau
Schlagworte Bildsensor • CCD image sensor • Deep-UV damage mechanisms • Design • Eximer laser • Imaging • Integrated circuit • Laser • Optimization • photodiode • semiconductor • Sensor • Technology • UV photodiodes • UV-Strahlung
ISBN-10 3-540-22680-X / 354022680X
ISBN-13 978-3-540-22680-2 / 9783540226802
Zustand Neuware
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