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Embedded Dielectrics For Electronic Packaging

Buch | Hardcover
300 Seiten
2025
World Scientific Publishing Co Pte Ltd (Verlag)
978-981-4619-41-7 (ISBN)
CHF 218,20 inkl. MwSt
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This book provides an overview of nanocomposite materials that can be used as embedded dielectric layer in high-density electronic packaging, for decoupling, filtering, energy storage or electrostatic discharge suppressing etc.
This book provides an overview of nanocomposite materials that can be used as embedded dielectric layer in high-density electronic packaging, for decoupling, filtering, energy storage or electrostatic discharge suppressing, etc. Some fundamental models used to analyze or predict the dielectric behavior of ceramic/polymer, conductor/polymer, and semiconductor/polymer composites are reviewed. This book also introduces design and synthesis of some novel hybrid filler particles, as well as graft modification on the polymer matrix to improve dielectric performance.

Category and Function of Embedded Capacitors; Mixing Theories for Composites; Research and Products of Two Phase Ceramic/Polymer Percolative Materials; Modification of Polymer Matrix; Hybrid Filler Particles; Design of Embedded Devices and Elements Based on Dielectric Film; Voltage Switchable Dielectric;

Erscheint lt. Verlag 31.5.2025
Reihe/Serie Wspc Series In Advanced Integration And Packaging
Verlagsort Singapore
Sprache englisch
Themenwelt Technik Elektrotechnik / Energietechnik
ISBN-10 981-4619-41-8 / 9814619418
ISBN-13 978-981-4619-41-7 / 9789814619417
Zustand Neuware
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