International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

Institute of Electrical and Electronics Engineers (Autor)

Buch | Hardcover

350 Seiten

2000 | 2000 ed.
I.E.E.E.Press (Verlag)
978-0-7803-6279-6 (ISBN)

Infos

The proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2000. Topics include: device simulation; quantum effects and novel devices; process simulation; lithography simulation; user interfaces and visualization; calibration; and more.

Produkt-Details

• Erscheint lt. Verlag: 30.9.2000
• Verlagsort: Piscataway NJ
• Sprache: englisch
• Maße: 216 x 279 mm
• Themenwelt: Technik ► Elektrotechnik / Energietechnik
• ISBN-10: 0-7803-6279-9 / 0780362799
• ISBN-13: 978-0-7803-6279-6 / 9780780362796
• Zustand: Neuware