Rapid Reliability Assessment of VLSICs
Springer-Verlag New York Inc.
978-1-4612-7879-5 (ISBN)
1 Introduction to VLSI Testing.- 1.1 The Problem.- 1.2 Reliability Testing.- 1.3 The CMOS Process.- 1.4 Failure Modes and Mechanisms in CMOS.- 1.5 Outline of the Project.- 1.6 Choice of Devices.- 1.7 Outline of the Book.- References.- 2 The Devices Studied and Their Simulation.- 2.1 Introduction.- 2.2 Details of the Devices Studied.- 2.3 SPICE Circuit Files and Device Parameters.- 2.4 Simulation Procedures.- 2.5 Results.- 2.6 Conclusions.- Reference.- 3 The Tests and Stress Experiments.- 3.1 Introduction to the Test Procedures.- 3.2 Accelerated Stress Methods.- 3.3 Details of the Tests Used.- 3.4 Organization of the Experiment.- References.- 4 Assessment of the Tests as Predictors of Failure.- 4.1 Behavior of the Devices Subject to Thermal and Electrical Stress.- 4.2 Behavior of Devices Subject to Ionizing Irradiation Stress.- 4.3 Assessment of the Tests.- References.- 5 Implementation of the Tests for Industrial Use.- 5.1 Introduction.- 5.2 Test Strategies.- 5.3 Extension of Tests to VLSI.- 5.4 Implementation of the Test on a Digital Tester.- 5.5 Reliability Test Equipment and Techniques.- 5.6 Implementation of the Tests using Dedicated Analog Circuits.- 5.7 Application to Other Digital Families.- References.- 6 Conclusions.- 6.1 Validity of the Experiments.- 6.2 Recommended Tests.- 6.3 Use of the Tests.- 6.4 Further Work.- Appendix 1 SPICE Circuit Files Used in the Simulations.
Zusatzinfo | 212 p. |
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Verlagsort | New York, NY |
Sprache | englisch |
Maße | 170 x 244 mm |
Themenwelt | Mathematik / Informatik ► Informatik ► Theorie / Studium |
Technik ► Elektrotechnik / Energietechnik | |
Technik ► Maschinenbau | |
ISBN-10 | 1-4612-7879-1 / 1461278791 |
ISBN-13 | 978-1-4612-7879-5 / 9781461278795 |
Zustand | Neuware |
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