Design for Manufacturability

From 1D to 4D for 90–22 nm Technology Nodes

Artur Balasinski (Autor)

Buch | Softcover

278 Seiten

2016 | Softcover reprint of the original 1st ed. 2014
Springer-Verlag New York Inc.
978-1-4939-4342-5 (ISBN)

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This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.

Artur Balasinski is a Technology Design Integration Manager for Cypress Semiconductor in San Jose, California.

Preface.- Classic DfM: from 2D to 3D.- DfM at 28 nm and Beyond.- New DfM Domain: Stress Effects.- Conclusions and Future Work.

Erscheinungsdatum	11.08.2016
Zusatzinfo	45 Illustrations, color; 169 Illustrations, black and white; VIII, 278 p. 214 illus., 45 illus. in color.
Verlagsort	New York
Sprache	englisch
Maße	155 x 235 mm
Themenwelt	Technik ► Bauwesen
	Technik ► Elektrotechnik / Energietechnik
	Technik ► Maschinenbau
Schlagworte	22nm technology node DFM • 3D Design for manufacturability • design for manufacturability • DFM • Integrated Circuits • Memory Design for manufacturability • System in Package • System on chip • X-fab manufacturability
ISBN-10	1-4939-4342-1 / 1493943421
ISBN-13	978-1-4939-4342-5 / 9781493943425
Zustand	Neuware